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TECHNICAL PAPERS

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

[+] Author and Article Information
Octavio Leon, Gilbert De Mey

Department of Electronics and Information Systems, Ghent University, Sint Pietersnieuwstraat 41, 9000 Ghent, Belgium

Erik Dick, Jan Vierendeels

Department of Flow, Heat, and Combustion, Ghent University, Sint Pietersnieuwstraat 41, 9000 Ghent, Belgium

J. Electron. Packag 125(3), 442-446 (Sep 17, 2003) (5 pages) doi:10.1115/1.1602709 History: Received October 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Incropera,  F. P., 1988, “Convection Heat Transfer in Electronic Equipment Cooling,” Int. J. Heat Mass Transfer, 110, Nov., pp. 1097–1111.
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Azar,  K., 2000, “The History of the Power Dissipation,” J. Electronics Cooling, 6 (2), pp. 42–50.
Maling,  G. C., and Yeager,  D. M., 1996, “Minimizing Acoustical Noise in Electronic Systems,” J. Electronics Cooling, 2 (2), pp. 14–17.
Soodphakdee, D., et al., 1998, “A Comparison of Heat Sink Geometries for Laminar Forced Convection: Numerical Simulation of Periodically Developed Flow,” The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, Washington, pp. 310–315.
Wirtz,  R. A., and Colban,  D. M., 1996, “Comparison of the Cooling Fin Performance of Staggered and In-Line Arrays of Electronic Packages,” ASME J. Electron. Packag., 118, pp. 27–30.
Zhang,  L. W., , 1997, “Heat Transfer Enhancement Mechanisms in Inline and Staggered Parallel-Plate Fin Heat Exchanger,” Int. J. Heat Mass Transfer, 40, pp. 2307–2325.
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Incropera, F. P., and De Witt, D. P., 1985, Introduction to Heat Transfer, John Wiley & Sons, New York, pp. 243–369.
Mereu,  S., Sciubba,  E., and Bejan,  A., 1993, “The Optimal Cooling of a Stack of Heat Generating Boards with Fixed Pressure Drop, Flow Rate or Pumping Power,” Int. J. Heat Mass Transfer, 36, pp. 3677–3686.
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León,  O., De Mey,  G., and Dick,  E., 2002, “Study of the Optimal Layout of Cooling Fins in Forced Convection Cooling,” Microelectron. Reliab., 42, pp. 1101–1111.

Figures

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(a) Temperature distribution in the Standard model at 1 m/s, (b) temperature distribution in the Staggered A model at 1 m/s, (c) temperature distribution in the Staggered-B model at 1 m/s
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Effects of uo (incoming flow velocity) on the quality factor. Comparison between standard and staggered-B models. Quality factor for uo∼4.5–5.5 m/s.
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Effects of uo (incoming flow velocity), on power input and quality factor. Comparison between standard, staggered-A, and staggered-B models. (a) power input; (b) quality factor for uo∼0.66–1.2 m/s.
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Effects of uo (incoming flow velocity), on total heat removed and pressure drop. Comparison between standard, staggered-A, and staggered-B models. (a) total heat removed; (b) pressure drop.
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Staggered model B: To=300 K,Tw=423 K,D=4 mm
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Staggered model A: To=300 K,Tw=423 K,D=4 mm
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Standard model: To=300 K,Tw=423 K,D=4 mm

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