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TECHNICAL PAPERS

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

[+] Author and Article Information
Cemal Basaran, Yujun Wen

Electronic Packaging Laboratory, 212 Ketter Hall, University at Buffalo, State University of New York, Buffalo, NY 14260, USA

J. Electron. Packag 125(3), 426-430 (Sep 17, 2003) (5 pages) doi:10.1115/1.1602707 History: Received August 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Figures

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Schematic of the specimen on the fixture
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Cross section of the BGA package
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Temperature profile of thermal cycle loading
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(a) Initial state, the average phase size d0=3.017 μm. (b) After 150 cycles, the average phase size d150=4.645 μm. (c) After 250 cycles, the average phase size d250=5.096 μm. (d) After 300 cycles, the average phase size d300=5.231 μm.
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Comparison of the phase size change between simulation and observation

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