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TECHNICAL PAPERS

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

[+] Author and Article Information
Takehiro Saitoh

Advanced Technology Development Division, NEC Electronics Corp., 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198 Japane-mail: t-saitoh@cw.jp.nec.com

Hidehito Matsuyama

Scientific Systems Division, NEC Informatec Systems, Ltd., 3-2-1, Sakado, Takatsu, Kawasaki, Kanagawa, 213-0012 Japane-mail: matsu@ssd.nis.nec.co.jp

Masayuki Toya

Department of Mechanical Engineering, Kagoshima University, 1-21-40, Kohrimoto, Kagoshima, Kagoshima, 890-0065 Japane-mail: toyamasa@mech.kagoshima-u.ac.jp

J. Electron. Packag 125(3), 420-425 (Sep 17, 2003) (6 pages) doi:10.1115/1.1602706 History: Received July 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Figures

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One-half transverse cross-sectional view of standard plastic-packaged LSI
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Dimensions of one-half transverse cross-section of package model
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Kr85 penetration of Cu alloy leadframe package with wax after 50 cycles: (a) test image, (b) diagrammatical sketch.
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Number of penetrated unwaxed packages vs number of cycles
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Kr85 penetration of Cu alloy leadframe package after 50 cycles without wax: (a) test image, (b) diagrammatical sketch.
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Kr85 penetration of alloy 42 leadframe package after 50 cycles without wax: (a) test image, (b) diagrammatical sketch.
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Cylindrical coordinates with origin at lower wedge tip
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Enlarged portion of FE mesh near die pad edge
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Effect of distance on fracture parameters and cracking angles in Cu alloy leadframe packages.
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Effect of distance on fracture parameters and cracking angles in alloy 42 leadframe packages.
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SEM photograph of cross section in Cu alloy leadframe package (case 1) after 1000 cycles
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SEM photograph of cross section in alloy 42 leadframe package (case 4) after 1000 cycles

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