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TECHNICAL PAPERS

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

[+] Author and Article Information
Takehiro Saitoh

Advanced Technology Development Division, NEC Electronics Corp., 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198 Japane-mail: t-saitoh@cw.jp.nec.com

Hidehito Matsuyama

Scientific Systems Division, NEC Informatec Systems, Ltd., 3-2-1, Sakado, Takatsu, Kawasaki, Kanagawa, 213-0012 Japane-mail: matsu@ssd.nis.nec.co.jp

Masayuki Toya

Department of Mechanical Engineering, Kagoshima University, 1-21-40, Kohrimoto, Kagoshima, Kagoshima, 890-0065 Japane-mail: toyamasa@mech.kagoshima-u.ac.jp

J. Electron. Packag 125(3), 420-425 (Sep 17, 2003) (6 pages) doi:10.1115/1.1602706 History: Received July 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Williams,  M. L., 1952, “Stress Singularities Resulting From Various Boundary Conditions in Angular Corners of Plates in Extension,” J. Appl. Mech., 74, pp. 526–528.
Theocaris,  P. S., and Gdoutos,  E. E., 1977, “Stress Singularities in Cracked Composite Full-Planes,” Int. J. Fract., 13, pp. 763–773.
Chen,  D., and Nishitani,  H., 1991, “Stress Fields near the Corner of Jointed Dissimilar Materials,” Trans. Jpn. Soc. Mech. Eng., Ser. A, 57, pp. 146–152 (in Japanese).
Lee,  H., and Earmme,  Y. Y., 1996, “A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Cracks,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 168–178.
Liu,  S., Zhu,  J., Zou,  D., and Benson,  J., 1997, “Study of Delaminated Plastic Packages by High Temperature Moiré and Finite Element Method,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, pp. 505–512.
Tay,  A. A. O., and Lin,  T. Y., 1999, “Influence of Temperature, Humidity, and Defect Location on Delamination in Plastic IC Packages,” IEEE Trans. Compon., Packag. Technol., 22, pp. 512–518.
Tanaka,  N., Kitano,  M., Kumazawa,  T., and Nishimura,  A., 1999, “Evaluating IC-Package Interface Delamination by Considering Moisture-Induced Molding-Compound Swelling,” IEEE Trans. Compon., Packag. Technol., 22, pp. 426–432.
Gupta,  S., Hydro,  R. M., and Pearson,  R. A., 1999, “Fracture Behavior of Isotropically Conductive Adhesives,” IEEE Trans. Compon., Packag. Technol., 22, pp. 209–214.
Saitoh,  T., Matsuyama,  H., and Toya,  M., 1998, “Linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in LSI Plastic Packages Under Temperature Cyclic Loading,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 21, pp. 422–427.
Saitoh,  T., 1996, “Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages Under Temperature Cyclic Loading,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 19, pp. 593–600.
Saitoh,  T., and Toya,  M., 1997, “Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages Under Temperature Cyclic Loading—Part II: Using Alloy 42 as Leadframe Material,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 20, pp. 176–183.
Rice,  J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,” J. Appl. Mech., 55, pp. 98–103.
Dundurs,  J., 1969, “Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading,” J. Appl. Mech., 36, pp. 650–652.

Figures

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One-half transverse cross-sectional view of standard plastic-packaged LSI
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Dimensions of one-half transverse cross-section of package model
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Kr85 penetration of Cu alloy leadframe package with wax after 50 cycles: (a) test image, (b) diagrammatical sketch.
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Number of penetrated unwaxed packages vs number of cycles
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Kr85 penetration of Cu alloy leadframe package after 50 cycles without wax: (a) test image, (b) diagrammatical sketch.
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Kr85 penetration of alloy 42 leadframe package after 50 cycles without wax: (a) test image, (b) diagrammatical sketch.
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Cylindrical coordinates with origin at lower wedge tip
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Enlarged portion of FE mesh near die pad edge
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Effect of distance on fracture parameters and cracking angles in Cu alloy leadframe packages.
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Effect of distance on fracture parameters and cracking angles in alloy 42 leadframe packages.
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SEM photograph of cross section in Cu alloy leadframe package (case 1) after 1000 cycles
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SEM photograph of cross section in alloy 42 leadframe package (case 4) after 1000 cycles

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