0
TECHNICAL PAPERS

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

[+] Author and Article Information
Ji Eun Park

Lockheed Martin Aeronautics Company, 86 South Cobb Dr., Dept. 6E5M Zone 0987, Marietta, GA 30063-0915

Iwona Jasiuk

Georgia Institute of Technology, The G. W. W. School of Mechanical Engineering, Atlanta, GA 30332-0405

Aleksander Zubelewicz

Los Alamos National Laboratory, MST-8, MS G755, Los Alamos, NM 87545

J. Electron. Packag 125(3), 400-413 (Sep 17, 2003) (14 pages) doi:10.1115/1.1602480 History: Received September 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Suhir,  E., 1986, “Stresses in Bi-Metal Thermostat,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir,  E., 1989, “Interfacial Stresses in Bimaterial Thermostats,” ASME J. Appl. Mech., 56, pp. 595–600.
Kuo,  A. Y., 1989, “Thermal Stresses at the Edge of Bimetallic Thermostat,” ASME J. Appl. Mech., 56, pp. 585–589.
Lau,  J. H., 1989, “A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods,” ASME J. Electron. Packag., 111, pp. 313–320.
Lee,  M., and Jasiuk,  I., 1991, “Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips,” ASME J. Electron. Packag., 113, pp. 173–177.
Eischen,  J. W., Chung,  C., and Kim,  J. H., 1990, “Realistic Modeling of Edge Effect Stresses in Bimaterial Elements,” ASME J. Electron. Packag., 112, pp. 16–23.
Rice,  J. R., 1968, “A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks,” ASME J. Appl. Mech., 35, pp. 379–386.
Eshelby,  J. D., 1975, “The Elastic Energy-Momentum Tensor,” J. Elast., 5, pp. 321–35.
Smelser,  R. E., and Gurtin,  M. E., 1977, “On the J-Integral for Bi-Material Bodies,” Int. J. Fract., 13, pp. 382–384.
Park,  J. H., and Earmme,  Y. Y., 1986, “Application of Conservation Integrals to Interfacial Crack Problems,” Mech. Mater., 5, pp. 261–276.
Sun,  C. T., and Wu,  X. X., 1996, “On the J-Integral in Periodically Layered Composites,” Int. J. Fract., 77, pp. 89–100.
Weichert,  D., and Schulz,  M., 1993, “J-integral Concept for Multi-Phase Materials,” Comput. Mater. Sci., 1, pp. 241–248.
Haddi,  A., and Weichert,  D., 1996, “On the Computation of the J-Integral for Three-Dimensional Geometries in Inhomogeneous Materials,” Comput. Mater. Sci., 5, pp. 143–150.
Haddi,  A., and Weichert,  D., 1997, “Elastic-Plastic J-Integral in Inhomogeneous Materials,” Comput. Mater. Sci., 8, pp. 251–260.
Charalambides,  P. G., Lund,  J., Evans,  A. G., and McMeeking,  R. M., 1989, “A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces,” ASME J. Appl. Mech., 56, pp. 77–82.
Hamoush,  S. A., and Ahmad,  S. H., 1989, “Mode I and Mode II Stress Intensity Factors for Interfacial Cracks in Bi-Material Media,” Eng. Fract. Mech., 33, pp. 421–427.
Pao,  Y. H., and Pan,  T. Y., 1990, “Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems,” ASME J. Electron. Packag., 112, pp. 154–161.
Matos,  P. P. L., McMeeking,  R. M., Charalambides,  P. G., and Drory,  M. D., 1989, “A Method for Calculating Stress Intensities in Bimaterial Fracture,” Int. J. Fract., 40, pp. 235–254.
Park,  J. E., Jasiuk,  I., and Zubelewicz,  A., 2003, “Stresses and Fracture Along the Chip/Underfill Interface in Flip Chip Assemblies,” ASME J. Electron. Packag. 125, pp. 44–52.
Eshelby,  J. D., 1957, “The Determination of the Elastic Field of an Ellipsoidal Inclusion, and Related Problems,” Proc. R. Soc. London, Ser. A, 241, pp. 376–396.
Shioya,  S., 1967, “On a Semi-Infinite Thin Plate With Circular Inclusion Under Uniform Tension,” Bull. Jpn. Soc. Mech. Eng., 10, pp. 1–9.
Richardson,  M. K., 1969, “Interference Stress in a Half Plane Containing an Elastic Disk of Same Material,” ASME J. Appl. Mech., 36, pp. 128–130.
Lee,  M., Jasiuk,  I., and Tsuchida,  E., 1992, “The Sliding Circular Inclusion in an Elastic Half-Plane,” ASME J. Appl. Mech., 59, pp. 57–64.
Al-Ostaz,  A., Jasiuk,  I., and Lee,  M., 1998, “Circular Inclusion in Half-Plane: Effect of Boundary Conditions,” ASCE J. Eng. Mech., 124, pp. 293–299.
Yu,  H. Y., and Sanday,  S. C., 1992, “Elastic Inhomogeneous Inclusion and Inhomogeneity in Bimaterials,” Proc. R. Soc. London, Ser. A, 439, pp. 659–667.
Park, J. E., Jasiuk, I., and Zubelewicz, A., 2000, “Interfacial Stress Analysis in Electronic Packaging Assemblies With Various Effective Properties of Underfill,” Prtoceedings of the SECTAM-XX (ed. H.V. Tippur), Callaway Gardens, Pine Mountain, GA.
Michaelides,  S., and Sitaraman,  S. K., 1999, “Die Cracking and Reliable Die Design for Flip-Chip Assemblies,” IEEE Trans. Adv. Packag., 22, pp. 602–613.
Hanna, C. E., and Sitaraman, S. K., 1999, “Role of Underfill Materials and Thermal Cycling on Die Stresses,” Advances in Electronic Packaging, EEP-Vol. 26-1, InterPACK 99, ASME, pp. 795–801.
Yeh,  C. P., Zhou,  W. X., and Wyatt,  K., 1996, “Parametric Finite-Element Analysis of Flip-Chip Structures,” Int. J. Microcircuits Electron. Packag., 19, pp. 120–127.
ABAQUS , Version 5.6, 1995, Hibbit, Karlsson & Sorensen, Inc., USA.
Rice,  J. R., and Sih,  G. C., 1965, “Plane Problems of Cracks in Dissimilar Media,” ASME J. Appl. Mech., 32, pp. 418–423.
Rice,  J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,” ASME J. Appl. Mech., 57, pp. 98–103.
Budiansky,  B., Hutchinson,  J. W., and Lambropoulos,  J. C., 1983, “Continuum Theory of Dilatant Transformation Toughening in Ceramics,” Int. J. Solids Struct., 19, pp. 337–355.
McMeeking,  R. M., and Evans,  A. G., 1982, “Mechanics of Transformation Toughening in Brittle Materials,” J. Am. Ceram. Soc., 65, pp. 242–246.
Park, J. E., 2001, “Micromechanics-Based Interfacial Stress Analysis and Fracture in Electronic Packaging Assemblies With Heterogeneous Underfill,” Ph.D. dissertation, Georgia Institute of Technology, Atlanta, GA.
Timoshenko, S. P., and Goodier, J. N., 1978, Theory of Elasticity, McGraw-Hill, New York, NY.

Figures

Grahic Jump Location
Bi-material strip with heterogeneous underfill
Grahic Jump Location
Arrangements of particles. (a) One particle near the interface and edge. (b) Two particles near the interface and edge; one particle moved along the horizontal axis. (c) Two particles moved vertically away from the interface. (d) Three particles near the interface and edge.
Grahic Jump Location
Deformed shape of the bi-material strip with displacement magnification factor of 13.3
Grahic Jump Location
Interfacial stresses for the case of underfill with no particles (on the horizontal axis, 0 indicates 90% of the chip length from the centerline and 1 the edge of the chip). (a) Interfacial normal stress; (b) interfacial shear stress.
Grahic Jump Location
Interfacial stresses for the case of one particle in the underfill near the interface and edge (on the horizontal axis, 0 indicates 90% of the chip length from the centerline and 1 the edge of the chip). (a) Interfacial normal stress; (b) interfacial shear stress.
Grahic Jump Location
Maximum interfacial normal stresses due to one particle moved vertically down away from the interface [Fig. 2(a)]; distance is taken from the particle’s center to the interface
Grahic Jump Location
Maximum interfacial normal stresses versus the distance between two particles’ centers [see Fig. 2(b)]; one particle is moved horizontally
Grahic Jump Location
Two random particle configurations. (a) Random case 30; (b) Random case 7.
Grahic Jump Location
Random particle arrangements. (a) Interfacial normal stress. (b) Interfacial shear stress. (c) J integral.
Grahic Jump Location
Mean of interfacial normal stress versus number of realizations
Grahic Jump Location
Standard deviation of interfacial normal stress versus number of realizations
Grahic Jump Location
Mean of interfacial shear stress versus number of realizations
Grahic Jump Location
Standard deviation of interfacial shear stress versus number of realizations
Grahic Jump Location
Mean of the J integral versus number of realizations
Grahic Jump Location
Standard deviation of the J integral versus number of realizations
Grahic Jump Location
Probability density function chart of random particle distributions. (a) Interfacial normal stress. (b) Interfacial shear stress. (c) J integral.
Grahic Jump Location
Probability paper chart of random particle distributions. (a) Interfacial normal stress. (b) Interfacial shear stress. (c) J integral.

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In