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TECHNICAL PAPERS

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

[+] Author and Article Information
T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua

Agere Systems Singapore Pte Ltd, 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278

Y. Y. Ma

Institute of Microelectronics, A*Star, Singapore Science Park II, Singapore 117685e-mail: yiyi@ime.a-star.edu.sg

J. Electron. Packag 125(3), 392-399 (Sep 17, 2003) (8 pages) doi:10.1115/1.1602704 History: Received September 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

STATS, “Stacked Die Low Profile Quad Flat Pack,” www.stts.com (2002).
UTAC-News Release, “UTAC Partners With M-systems in MCP Leaded and Array Packages,” www.utac.com.sg (2002).
Yu, Z. Y., and Budi, N., 2002, “Backgrind and Sawing Process for Stacked Die Package,” Agere Internal Report.
Buhlmann, P., and Truncellito, D., 2002, “Die Attach—Today’s Challenge,” Advanced Packaging Magazine, April, pp. 31–33.
Ablestik Technical Program, “Materials for Chip Stacking,” Semicon West (2001).
Yao, Y. F., 2002, “Feasibility Studies for Wire Bonding of the Stacked Die on Leaded Packages,” Agere Internal Report.
Lin, T. Y., 2002, “Moldability Studies for 100TQFP Stacked Die Packages,” Agere Internal Reports.
Xiong, Z. P., 2002, “Die Attaching Process Evaluation on 100TQFP,” Agere Internal Reports.
Fukuzawa, I., Ishiguro, S., and Nanbu, S., 1985, “Moisture Resistance Degradation of Plastic LST’s by Reflow Soldering,” Proceedings of the 23rd International Reliability Physics Symposium, pp. 192–197.
Tay, A. A. O, and Lin, T. Y., 1996, “Effects of Moisture and Delamination on Cracking of Plastic IC Packages During Solder Reflow,” in Proceedings of the 46th ECTC, pp. 777–782.
Lin,  T. Y., and Tay,  A. A. O., 1997, “Dynamics of Moisture Diffusion, Hygrothermal Stresses and Delamination in Plastic IC Packages,” in ASME EEP, Advances in Electronic Packaging,19-1, pp. 1429–1436.
Tay,  A. A. O., and Lin,  T. Y., 1996, “Moisture Diffusion and Heat Transfer in Plastic IC Packages,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 186–193.
Wong, E. H., Rajoo, R., Koh, S. W., and Lim, T. B., 2002, “The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging,” pp. 122–126, Vol. 124, June.

Figures

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Flow chart for 100TQFP with stacked die assembly process
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Flow chart for standard 100TQFP assembly process (single die)
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Fishbone diagram on identification of delamination between the lead-frame paddle/mold compound interface
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The failure description (delamination and popcorn cracking) in stacked leaded packages
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Photos of results on SAM performed by the typical through mode functions
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The schematic failure mode of 100TQFP with the stacked die at the lead-frame paddle/mold compound interface
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Die attach delamination by SEM for 100TQFP with a single die
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Die attach paste void or incomplete coverage (fillet) by x ray for EP2 after die attach curing
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FEA model for 100TQFP with a single die (focus on single-die and lead-frame areas)
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FEA model for 100TQFP with stacked die (focus on stacked die areas)
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Maximum principal stress distribution along paddle/mold compound interface for TQFP100 with stacked die
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Maximum principal stress distribution along paddle/mold compound interface for TQFP100 with a single die
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Maximum principal stress distribution along paddle/die attach paste interface for TQFP100 with stacked die
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Maximum principal stress distribution along paddle/die attach paste interface for TQFP100 with a single die

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