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TECHNICAL PAPERS

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

[+] Author and Article Information
T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua

Agere Systems Singapore Pte Ltd, 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278

Y. Y. Ma

Institute of Microelectronics, A*Star, Singapore Science Park II, Singapore 117685e-mail: yiyi@ime.a-star.edu.sg

J. Electron. Packag 125(3), 392-399 (Sep 17, 2003) (8 pages) doi:10.1115/1.1602704 History: Received September 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Figures

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The schematic failure mode of 100TQFP with the stacked die at the lead-frame paddle/mold compound interface
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Photos of results on SAM performed by the typical through mode functions
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The failure description (delamination and popcorn cracking) in stacked leaded packages
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Fishbone diagram on identification of delamination between the lead-frame paddle/mold compound interface
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Flow chart for standard 100TQFP assembly process (single die)
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Flow chart for 100TQFP with stacked die assembly process
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Die attach delamination by SEM for 100TQFP with a single die
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Die attach paste void or incomplete coverage (fillet) by x ray for EP2 after die attach curing
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FEA model for 100TQFP with a single die (focus on single-die and lead-frame areas)
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FEA model for 100TQFP with stacked die (focus on stacked die areas)
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Maximum principal stress distribution along paddle/mold compound interface for TQFP100 with stacked die
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Maximum principal stress distribution along paddle/mold compound interface for TQFP100 with a single die
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Maximum principal stress distribution along paddle/die attach paste interface for TQFP100 with stacked die
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Maximum principal stress distribution along paddle/die attach paste interface for TQFP100 with a single die

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