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TECHNICAL PAPERS

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

[+] Author and Article Information
Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226-3699

J. Electron. Packag 125(3), 386-391 (Sep 17, 2003) (6 pages) doi:10.1115/1.1602703 History: Received September 01, 2001; Revised March 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Prasher,  R. S., 2001, “Surface Chemistry Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials,” J. Heat Transfer, 123, pp. 969–975.
Suddith,  R. D., 1993, “A Generalized Model to Predict the Viscosity of Solutions With Suspended Patilcles. 1,” J. Appl. Polym. Sci., 48, pp. 25–36.
Madhusudana, C. V., 1996, Thermal Contact Conductance, Springer-Verlag, New York.
Solbrekken, G., Chiu, C.-P., Byers, B., and Reichenbacher, D., 2000, “The Development of a Tool to Predict Package Level Thermal Interface Material Performance,” The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. 2, pp. 48–54.
Taylor, B. N., and Kuyatt, C. E., 1994, “Guidelines for Evaluating and Expressing the Uncertainty of NIST Measurement Results,” NIST Technical Note 1297, United States Department of Commerce, Washington, DC.
Holman, J. P., 1994, Experimental Methods for Engineers, McGraw-Hill, New York.
Lewis,  T. B., and Nielsen,  L. E., 1970, “Dynamic Mechanical Properties of Particulate Filled Composites,” J. Appl. Polym. Sci., 14, pp. 1449–1471.
Devpura, A., Phelan P. E., and Prasher, R. S., 2000, “Percolation Theory Applied to Study the Effect of Shape and Size of the Filler Particles in Thermal Interface Materials,” Proceedings of the ASME, HTD-Vol. 366-4, Heat Transfer Division-2000, Vol. 4, J. H. Kim, Principal Editor, pp. 365–371.
Progelhof,  R. C., Throne,  J. L., and Ruetsch,  R. R., 1976, “Methods for Predicting the Thermal Conductivity of Composite Systems: A Review,” Polym. Eng. Sci., 16, pp. 615–625.
Xu,  Y., Luo,  X., and Chung,  D. D. L., 2000, “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance,” J. Electron. Packag., 122, pp. 128–131.
Irvine, T. F., 1998, Handbook of Heat Transfer, 3rd ed., Rohsenow, W. M., Hartnett, J. P., and Cho, Y. I., eds., McGraw-Hill Professional, New York, p. 2.51.
Devpura,  A., Phelan,  P. E., and Prasher,  R. S., 2001, “Size Effects on the Thermal Conductivity of Polymers Laden With Highly Conductive Filler Particles,” J. Microscale Thermophys. Eng.,5, pp. 177–189.
Prasher, R. S., Alger, O., and Phelan, P. E., 2001, “A Unified Macroscopic and Microscopic Approach to Contact Conduction Heat Transfer,” Proc. 35th National Heat Transfer Conference, Anaheim, California.
Ball, R. C., and Richmond, P., 1980, “Dynamics of Colloidal Dispersion,” Vol. 9, no. 2, pp. 99–116.

Figures

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Mechanical length parameter versus v/P
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Schematic showing the various components of thermal resistances after the insertion of a thermal interface material
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(a) Interface tester for thermal conductivity and thermal resistance measurement, (b) Use of spacers to measure the thermal conductivity
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Thermal impedance versus BLT for different particle volume fractions for the measurement of thermal conductivity
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Thermal conductivity versus particle volume fraction
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Contact resistance versus particle volume fraction for the measurement with spacers
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Mechanical length parameter versus particle volume fraction for various pressures
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Measured thermal contact conductance of a sodium silicate based thermal interface material, as a function of volume percentage of boron nitride (BN) particles, normalized with respect to hc for no BN particles (Ref. 10)

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