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TECHNICAL PAPERS

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

[+] Author and Article Information
Ravi S. Prasher

CH5-157, Assembly Technology Development, Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226-3699e-mail: ravi.s.prasher@intel.com

J. Electron. Packag 125(3), 378-385 (Sep 17, 2003) (8 pages) doi:10.1115/1.1602479 History: Received September 01, 2001; Revised March 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Figures

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A typical heat pipe in operation
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(a) Various temperature drops in a heat pipe, (b) equivalent thermal resistances associated with various temperature drops in a heat pipe
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Experimental setup for the vapor chamber in remote cooling
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θevap versus heat source area for different power for vapor chamber
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qadiabatic versus temperature for different power of vapor chamber
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Experimental setup for the vapor chamber in active cooling
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Comparison of thermal model with experimental data for active cooling mode
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Schematic depicting the variation of maximum heat transport and heat carrying capacity (capillary limit) for heat pipe/vapor chamber technology

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