0
TECHNICAL PAPERS

Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages

[+] Author and Article Information
Hasan U. Akay

Yan Liu

Computational Mechanics Laboratory, Mechanical Engineering Department, Indiana University-Purdue University Indianapolis (IUPUI), Indianapolis, IN 46202

Mostafa Rassaian

Boeing Phantom Works, Structures Technology, Seattle, WA 98124

J. Electron. Packag 125(3), 347-353 (Sep 17, 2003) (7 pages) doi:10.1115/1.1569956 History: Received September 01, 2002; Online September 17, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Akay,  H. U., Paydar,  N. H., and Bilgic,  A., 1997, “Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique,” ASME J. Electron. Packag., 119, pp. 228–235.
Akay, H. U., Zhang, H., and Paydar, N. H., 1997, “Experimental Correlation of an Energy-Based Fatigue Life Prediction Method for Solder Joints,” Proc. ASME InterPACK’97, pp. 1567–1574.
Akay, H. U., Kaliappan, G., Paydar, N. H., and Rassaian, M., 1999, “A Study of Fatigue Life Predictions for PBGA Joints and Comparisons with Test Data,” Proc., ASME InterPACK’99, pp. 677–684.
Yao, Q., and Qu, J., 1999, “Effects of PWB Size on the Warpage of Flip Chip Assemblies,” Proc., ASME InterPACK’99, pp. 27–31.
Sakai, H., Ito, N., Kawase, K., Imamura, K., Ohno, M., and Motegi, M., 1999, “Thermal Fatigue Life Evaluation for The Solder Joint Ceramic BGA,” Proc., ASME InterPACK’99, pp. 255–261.
Lee, S. R., Newman, K., and Hu, L., 2000, “Thermal Fatigue Analysis of PBGA Solder Joints with the Consideration of Damage Evolution,” Packaging of Electronic and Photonic Devices, ASME, pp. 207–212.
Ternes, R., and Hauch, R., 2000, “Test Methodologies for Reliability Testing of Small Plated-Through Holes (Vias) and/or Ball Grid Array (BGA) Solder Joints,” The Boeing Company.
Syed,  A. R., 1995, “Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach,” ASME J. Electron. Packag., 117, June, pp. 116–122.
Paydar,  N., Tong,  Y., and Akay,  H. U., 1994, “A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints,” ASME J. Electron. Packag., 116, pp. 265–273.
Lam,  S. T., Arieli,  A., and Mukherjee,  A. K., 1979, “Superplastic Behavior of Pb-Sn Eutectic Alloy,” Mater. Sci. Eng., 40, pp. 73–79.
Kaliappan, G., 1999, “A Comparative Evaluation of Fatigue Life Prediction Methods for Solder Joint Assemblies,” Master of Science thesis, Purdue University.
Skipor,  A., Harren,  S., and Botsis,  J., 1995, “Constitutive Characterization of 63/37 Sn/Pb Eutectic Solder Using the Bodner-Partom Unified Creep-Plasticity Model,” Advances in Electronic Packaging, 117, pp. 130–135.
ABAQUS, User’s Manual, Hibbitt, Karlsson and Sorenson, Inc., Version 6.1, 2001.
Dasgupta,  A., Oyan,  D., and Pecht,  M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME J. Electron. Packag., 114, pp. 152–160.
Wen, L. C., Mon, G. R., and Ross, R. G., Jr., 1994, “Reliability Assessment of Solder Joints on LLCC Packages,” Jet Propulsion Laboratory Report No. JP D-11920, Pasadena, CA.
Lau,  J., Gowalkar,  S., Suratt,  R., and Boysan,  P., 1992, “Experimental and Analytical Studies of 28-pin Thin Small Outline Package (TSOP) Solder-Joint Reliability,” ASME J. Electron. Packag., 114, pp. 118–121.

Figures

Grahic Jump Location
(a) Top view of the ball-grid array of a typical PBGA package; (b) cross section of a typical PBGA package; (c) cross section of a typical PBGA package with a metal core
Grahic Jump Location
(a) A typical 1/8th FE model for PBGA package; (b) A typical sliced 3-D FE model for a PBGA package; (c) A typical 2-D FE model for a PBGA package
Grahic Jump Location
Comparison of creep dissipation energy from different FE models of 225-I/O PBGA
Grahic Jump Location
Curve-fitting for PBGA and conventional SMT packages by using different FE models
Grahic Jump Location
Comparison of prediction with experiments of three FE models for six types of PBGAs
Grahic Jump Location
Comparison of prediction with experiments of 2-D FE models for six types of SMTs

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In