Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

[+] Author and Article Information
A. Tavárez, J. E. González

Department of Mechanical Engineering, University of Puerto Rico-Mayaguez, Mayaguez, PR 00681-9045

J. Electron. Packag 125(3), 335-346 (Sep 17, 2003) (12 pages) doi:10.1115/1.1569955 History: Received February 21, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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Hwang, J. S., 1996, Modern Solder Technology for Competitive Electronics Manufacturing. Sec. 7.1. pp. 209, Sec. 8.2.3. pp. 231, The McGraw-Hill Co., New York, NY.
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Typical temperature profile of a SMT solder paste
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Velocity profile from (a) top heating panels, and (b) bottom heating panels
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Numerical model control volume
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Predicted reflow profile coupled with WL% of flux for (a) 0.8467 cm/s, and (b) 0.635 cm/s
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Predicted profiles at various conveyor speeds
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Predicted profiles at various oven settings coupled with WL% of flux
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Typical TGA curve provided by Indium Corp.
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Schematic of the experimental facility
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Schematic of SMT reflow oven
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Schematic of blower, heaters, and heating panel
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Schematic of solder paste pad and test board
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Temperature distributions of heating panels and convective gas
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Experimental solder paste temperature profiles
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Predicted reflow profile for the 96.5 Sn/3.5 Ag lead-free solder paste
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Predicted reflow profile for the 42Sn/58Bi lead-free solder paste
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Specific heat approximation of FR-4




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