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TECHNICAL PAPERS

Simulation of Void Growth in Molten Solder Bumps

[+] Author and Article Information
Ronald L. Panton, Jong W. Lee

Mechanical Engineering Department, University of Texas, Austin, TX

Lakhi Goenka, Achyuta Achari

Visteon, Electronics Technical Center, Dearborn, MI

J. Electron. Packag 125(3), 329-334 (Sep 17, 2003) (6 pages) doi:10.1115/1.1569954 History: Received April 16, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Chan,  Y. C., Xie,  D. J., and Lai,  J. K. L., 1996, “Experimental Studies of Pore Formation in Surface Mount Solder Joints,” Mater. Sci. Eng., B, 38(1–2), p. 53.
Goenka, L. N., and Achari, A., 1995, “Void Formation in Flip-Chip Solder Bumps: Part I,” 18th IEEE/CHMT Symposium, Austin TX.
Goenka, L. N., and Achari, A., 1996, “Void Formation in Flip-Chip Solder Bumps: Part II,” Nineteenth IEEE/CHMT Symposium, Austin TX.
Vural, C., 1998, private communication.
Davis,  A. M. J., 1989, “Thermocapillary Convection in Liquid Bridges: Solution Structure and Eddy Motions,” Phys. Fluids A, 1, p. 479.
Lee, J., 1999, “Analytical Model of Void Formation in Solder Bumps,” M.S. thesis, University of Texas.

Figures

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Cross section of a chip assembly in reflow oven
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Micrograph of two solder bumps (200-micron diameter) showing voids (photo by Bhattahacharya and Panton)
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Bulk flow velocity vector pattern in a r-z plane
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History of bubbles for the benchmark case
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Final bubble configuration for the benchmark case; melting from top to bottom
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Final bubble configuration for the benchmark case; melting from bottom to top

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