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TECHNICAL PAPERS

Packaging of Optical MEMS Devices

[+] Author and Article Information
Yee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle

Lucent Technologies Bell Labs, Murray Hill, NJ, 07974

Steven P. O’Neill, Khanh C. Nguyen

Agere Systems, Breinigsville, PA 18031

J. Electron. Packag 125(3), 325-328 (Sep 17, 2003) (4 pages) doi:10.1115/1.1535933 History: Received April 12, 2002; Online September 17, 2003
Copyright © 2003 by ASME
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References

Figures

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The optical cross-connect switch LTCC package
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The design of the multi-layer DGEF LTCC package
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DGEF integrated LTCC packages with micro connectors, flat flex cables and a fiber attached
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The LambdaRouter optical cross-connect switch in a 1024-pin HTCC PGA package
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Piece parts for thin-film ceramic packages: seal rings, thin film ceramics, PWBs with connectors, fiber sleeve, metal sub-mounts, etc
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The design of the FR-4 board, solder attached to the thin-film ceramic
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The design of the DGEF thin-film ceramic package
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DGEF thin-film ceramic packages with solder attached PWB board and micro connectors
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Metal header with a DGEF device wire-bonded to flex tapes (research prototype)
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Packaging of a DGEF device (research prototype)

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