Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

[+] Author and Article Information
Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

Z. Fathi

Lambda Technologies Inc. Morrisville, NC 27560

I. Ahmad

Lambda Technologies, Inc., Morrisville, NC 27560

J. Electron. Packag 125(2), 302-307 (Jun 10, 2003) (6 pages) doi:10.1115/1.1571077 History: Received February 15, 2001; Revised April 08, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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Grahic Jump Location
TMA analysis first run Dexter 4527 Microwave cure
Grahic Jump Location
TMA graph of 2nd run VFM cure (left) and 1st run convection cure (right)
Grahic Jump Location
Schematic diagram of flip-chip test board
Grahic Jump Location
ESEM image Dexter 4527 VFM cured with normal board orientation
Grahic Jump Location
Dexter 4527 convection oven cure with normal board orientation
Grahic Jump Location
Dexter 4527 VFM cured with flip board orientation
Grahic Jump Location
Dexter 4527 convection oven cure with flip board orientation
Grahic Jump Location
Stoke’s settling times as a function of underfill viscosity and filler particle radii less than 1 micron




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