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ADDITIONAL TECHNICAL PAPERS

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

[+] Author and Article Information
Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

Z. Fathi

Lambda Technologies Inc. Morrisville, NC 27560

I. Ahmad

Lambda Technologies, Inc., Morrisville, NC 27560

J. Electron. Packag 125(2), 302-307 (Jun 10, 2003) (6 pages) doi:10.1115/1.1571077 History: Received February 15, 2001; Revised April 08, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Figures

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TMA analysis first run Dexter 4527 Microwave cure
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TMA graph of 2nd run VFM cure (left) and 1st run convection cure (right)
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Schematic diagram of flip-chip test board
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ESEM image Dexter 4527 VFM cured with normal board orientation
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Dexter 4527 convection oven cure with normal board orientation
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Dexter 4527 VFM cured with flip board orientation
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Dexter 4527 convection oven cure with flip board orientation
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Stoke’s settling times as a function of underfill viscosity and filler particle radii less than 1 micron

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