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ADDITIONAL TECHNICAL PAPERS

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

[+] Author and Article Information
Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

J. Electron. Packag 125(2), 294-301 (Jun 10, 2003) (8 pages) doi:10.1115/1.1571076 History: Received February 15, 2001; Revised April 08, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Figures

Grahic Jump Location
ESEM Image of failed static RAM IC following VFM radiation
Grahic Jump Location
Photocurrent (lph) plots, pre and post-VFM processing (♦ pre-VFM; ▪ post-VFM)
Grahic Jump Location
CTR plots, pre and post-VFM processing (▪ post VFM; ♦ pre VFM)
Grahic Jump Location
Optical microscope picture of failed device

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