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ADDITIONAL TECHNICAL PAPERS

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moiré Interferometry

[+] Author and Article Information
Suk-Jin Ham, Soon-Bok Lee

CARE—Electronic Packaging Laboratory, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejon, 305-701, Korea

J. Electron. Packag 125(2), 282-288 (Jun 10, 2003) (7 pages) doi:10.1115/1.1571571 History: Received May 30, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Figures

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Specimen for moiré interferometry study: (a) specimen cut from CSP assembly, providing cross section having 15 solder bumps; (b) cross section of the solder bump of CSP assembly
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Small-sized thermal chamber with optical windows
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Finite element model for the CSP assembly studied
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Moiré fringes and FEA simulation of the right half of a CSP assembly corresponding to the isothermal loading case from 100°C to room temperature (ΔT=−75°C): (a) U displacement field; (b) V displacement field
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Relative displacement between the chip and the board in the x direction, and the nominal shear strain in each solder bump
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U displacement fields of the corner solder bumps induced by the isothermal loading from 100°C to room temperature (ΔT=−75°C): (a) after 1 day; (b) after 60 days. The contour interval is 417 nm per fringe.
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Vertical displacement along the centerline of the chip
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Moiré fringes and FEA simulation of the right half of a CSP assembly corresponding to the thermal loading case from room temperature to 100°C (ΔT=75°C): (a) U displacement field; (b) V displacement field
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U displacement fields of the corner solder bump induced by the thermal loading from room temperature to 100°C (ΔT=75°C): (a) just after heating to 100°C; (b) after 60 minutes. The contour interval is 417 nm per fringe.
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Macro and micro effects on the shear strain at four corners of the rightmost solder joint (adapted from 4).
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Superposition of macro and micro effects: (a) U displacement field of two solder bumps located at corner of the CSP assembly; (b) failure after an accelerated thermal cycling test (adapted from 2); (c) the distribution of shear strain ε12 in the rightmost solder bump

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