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TECHNICAL PAPERS

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

[+] Author and Article Information
E. Suhir

University of Illinois at Chicago, Chicago, IL

J. Electron. Packag 125(2), 261-267 (Jun 10, 2003) (7 pages) doi:10.1115/1.1569510 History: Received June 22, 2001; Online June 10, 2003
Copyright © 2003 by ASME
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