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Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

[+] Author and Article Information
E. Suhir

University of Illinois at Chicago, Chicago, IL

J. Electron. Packag 125(2), 261-267 (Jun 10, 2003) (7 pages) doi:10.1115/1.1569510 History: Received June 22, 2001; Online June 10, 2003
Copyright © 2003 by ASME
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References

Tummala, R. R., and Rymaszewski, E. J., 1989, MicroelectronicsPackaging Handbook, Van Nostrand Reinhold.
Lau, J. H., ed., 1991, Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York.
Lau, J. H., ed., 1993, Thermal Stress and Strain in Microelectronics Packaging, Van-Nostrand Reinhold, New York.
Lau, J. H., ed., 1994, Handbook on Fine Pitch Surface Mount Technology, Van Nostrand Reinhold, New York.
Lau, J. H., ed., 1994b, Chip on Board Technologies for Multichip Modules, Van Nostrand Reinhold, New York.
Lau, J. H., ed., 1995, Ball Grid Array Technology, McGraw-Hill, New York.
Lau, J. H., ed. 1996, Flip Chip Technologies, McGraw-Hill, New York
Lau, J. H., ed., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP and PBGA Assemblies, McGraw-Hill, New York.
Lau, J. H., Wong, C. P., Prince, J. L., and Nakayama, W., eds., 1998, Electronic Packaging, McGraw-Hill, New York, NY.
Lau, J. H., and Lee, S. W., eds., 1999, Chip Scale Packages: Design, Materials, Processes, Reliability, and Applications, McGraw-Hill, New York.
Lau, J. H., and Ricky Lee, S. W., 2001, Microvias, McGraw-Hill, New York.
Suhir, E., Cammarata, R. C., Chung, D. D. L., and Jono, M., eds. 1991, “Mechanical Behavior of Microelectronic Materials and Structures,” MRS Symposia Proc., Vol. 226, MRS, Pittsburgh, PA.
Suhir, E., Fukuda, M., and Kurkjian, C. R., eds., 1998, “Reliability of Photonic Materials and Structures,” Materials Research Society Symposia Proc., vol. 531.
Garrou,  P., 2000, “Wafer Level Chip Scale Packaging (WL-CSP): An Overview,” IEEE CPMT Trans., Part B, Advanced Packaging 23(2).
Suhir,  E., 2001, “Thermomechanical Stress Modeling in Microelectronics and Photonics,” Electronics Cooling,7(4).
Pecht, M., ed., 1991, Handbook on Electronic Packaging, Marcel Dekker, New York.
Pecht, M. et al., eds., 1995, Plastic Encapsulated Microelectronics, John Wiley and Sons, New York.
Suhir, E. et al., eds., 1998, “Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices,” Workshop Proc., ASME Press.
Suhir, E., and Lee, Y.-C., 1989, “Thermal, Mechanical, and Environmental Durability Design Methodologies,” ASM Electronic Materials Handbook, Vol. 1, Packaging, ASM Int.
Di Giacomo, G., 1997, Reliability of Electronic Packages and Semiconductor Devices; McGraw-Hill, New York.
Lang,  G. A. , 1970, “Thermal Fatigue in Silicon Power Devices,” IEEE Trans. Electron Devices, 17.
Suhir, E., 1995, “Structural Analysis in Fiber Optics,” J. Menon, ed., Trends in Lightwave Technology, Council of Scientific Information, India.
Suhir,  E., 1998, “Fiber Optic Structural Mechanics—Brief Review,” ASME J. Electron. Packag.,
Hobbs, G. K., 2001, Accelerated Reliability Engineering: HALT and HASS, John Wiley @ Sons, New York.
Katz, A., Pecht, M., and Suhir, E., 2000, “Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments,” IMAPS Int. Symposium on Microelectronics and Packaging, Israel.
Suhir,  E., 1989, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques,” ASME J. Electron. Packag., 111(2), June.
Suhir, E., 2000, “Modeling of the Mechanical Behavior of Microelectronic and Photonic Systems: Attributes, Merits, Shortcomings, and Interaction with Experiment,” Proc. 9th Int. Congress on Experimental Mechanics, Orlando, FL, June 5–8.
Suhir, E., 2000, “The Future of Microelectronics and Photonics, and the Role of Mechanical, Materials and Reliability Engineering,” Proc., Int. Conference on Materials in Microelectronics, MicroMat 2000, April 17–19, Berlin, Germany.
Suhir, E., 1997, Applied Probability for Engineers and Scientists, McGraw Hill, New York.
Suhir,  E., 2000, “Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension,” Int. J. Microcircuits Electron. Packag., 23(2) (invited paper).
Suhir,  E., and Poborets,  B., 1990, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability,” ASME J. Electron. Packag., 112(2).
Timoshenko,  S. P., 1925, “Analysis of Bi-Metal Thermostats,” J. Opt. Soc. Am., 11.
Volkersen,  O., 1938, “Die Nietkraftverteilung in Zubeanspruchten Nietverbindungen mit konstanten Laschenquerschnitten,” Luftfahrtforschung, 15.
Aleck,  B. J., 1949, “Thermal Stresses in a Rectangular Plate Clamped Along an Edge,” ASME J. Appl. Mech., 16.
Strinivas, S., 1975, “Analysis of Bonded Joints,” NASA Technical Note D-7855.
Ojalvo,  I. U., and Eidinoff,  H. L., 1978, “Bond Thickness Effects Upon Stresses in Single Lap Adhesive Joints,” AIAA J., 16(3).
Chen,  W. T., and Nelson,  C. W., 1979, “Thermal Stresses in Bonded Joints,” IBM J. Res. Dev., 23(2)
Chang, F.-V., 1983, “Thermal Contact Stresses of Bi-Metal Strip Thermostat,” Applied Mathematics and Mechanics, vol. 4, No. 3, Tsing-hua Univ., Beijing, China.
Glascock,  H. H., and Webster,  H. J., 1984, “Structural Copper: a Pliable High Conductance Material for Bonding to silicon Power Devices,” IEEE CHMT Trans., 6(4).
Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Proc., Int. Symposium on Microelectronics, ISHM, Atlanta, GA, Oct.
Suhir,  E., 1986, “Stresses in Bi-Metal Thermostats,” ASME J. Appl. Mech., 53(3), Sept.
Suhir,  E., 1989, “Interfacial Stresses in Bi-Metal Thermostats,” ASME J. Appl. Mech., 56(3).
Suhir, E., 1989 “Calculated Stresses in Microelectronic and Fiber-Optic Structures,” Proc., 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janiero, Brazil, Jan.
Suhir,  E., 1989, “Thermally Induced Stresses in Elongated Bi-Material Plates,” Appl. Mech. Rev., 1989 Supplement, “Mechanics Pan America 1989, Selected and Revised Proc., Rio de Janeiro Pan American Congress of Applied Mechanics, C. R. Steele, A. W. Leissa, and M. R. M. Crespo de Silva, eds., 42, No. 11, part 2 (Nov.1989).
Suhir, E., 1991, “Structural Analysis in Microelectronic and Fiber Optic Systems,” vol. 1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis, Van Nostrand Reinhold, New York.
Hall,  P. M. , 1990, “Strains in Aluminum-Adhesive-Ceramic Trilayers,” ASME J. Electron. Packag., 112(4).
Cifuentes,  A. O., 1991, “Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads,” ASME J. Electron. Packag., 113(4).
Lau,  J. H., 1992, “Thermoelastic Solutions for a Semi-Infinite Substrate with an Electronic Device,” ASME J. Electron. Packag., 114(3).
Zeyfang,  R., 1971, “Stresses and Strains in a Plate Bonded to a Substrate: Semiconductor Devices,” Solid-State Electronics,14.
Eischen,  J. W., Chung,  C., and Kim,  J. H., 1990, “Realistic Modeling of the Edge Effect Stresses in Bimaterial Elements,” ASME J. Electron. Packag., 112(1).
Kuo,  A. Y., 1990, “Thermal Stress at the Edge of a Bi-Metallic Thermostat,” ASME J. Appl. Mech., 57.
Yamada,  S. E., 1992, “A Bonded Joint Analysis for Surface Mount Components,” ASME J. Electron. Packag., 114(1).
Pan,  T.-Y., and Pao,  Y.-H., 1990, “Deformation of Multilayer Stacked Assemblies,” ASME J. Electron. Packag., 112(1).
Suhir,  E., 2000, “Predicted Stresses in a Circular Substrate/Thin-Film System Subjected to the Change in Temperature,” J. Appl. Phys., 88, No. 5.
Suhir,  E., 2001c, “Thermal Stress in a Bi-Material Assembly Adhesively Bonded at the Ends,” J. Appl. Phys., 89(1).
Suhir, E., 1987, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment,” Proc., 37th Elect. Comp. Conf., IEEE, Boston, MA, May.
Lau,  J. H., 1989, “A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite-Element Method,” ASME J. Electron. Packag., 111(12).
Glaser,  J. C., 1990, “Thermal Stresses in Compliantly Joined Materials,” ASME J. Electron. Packag., 112(1).
Mishkevich,  V., and Suhir,  E., 1998, “Simplified Engineering Approach for the Evaluation of Thermally Induced Stresses in Bi-Material Microelectronic Structures,” Int. J. Microelectronic Packaging,1.
Suhir,  E., 1991, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit,” ASME J. Electron. Packag., 113(3).
Morgan,  H. S., 1991, “Thermal Stresses in Layered Electrical Assemblies Bonded With Solder,” ASME J. Electron. Packag., 113(4).
Suhir,  E., 1989, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder, with Application to Low Temperature Strains and Stresses in Solder Joints,” ASME J. Appl. Mech., 56(2).
Suhir,  E., 1989, “Twist-off Testing of Solder Joint Interconnections,” ASME J. Electron. Packag., 111(3).
Suhir, E., 1992, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies,” Proc., 42nd Electr. Comp. and Techn. Conf., IEEE, San Diego, CA, May.
Suhir, E., 1997, “Solder Materials and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses,” Proc., Int. Symp. on “Design and Reliability of Solders and Solder Interconnections,” Orlando, FL, Feb.
Buratynski, E. K., 1997, “Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability,” E. Suhir et al., Advances in Electronic Packaging 1997, ASME Press.
Hwang, J. S., 1996, Modern Solder Technology for Competitive Electronics Manufacturing, McGraw-Hill, New York
Guo,  Z., Sprecher,  A. F., and Conrad,  J., 1992, “Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue,” ASME J. Electron. Packag., 114.
Akay,  J. U., and Tong,  Y., 1993, “Thermal Fatigue Analysis of an SMT Solder Joint Using FEM Approach,” J. Microcircuits and Electronic Packaging,116.
Ling,  S., and Dasgupta,  A., 1996, “A Nonlinear Multidomain Stress-Analysis Method for Surface-Mount Solder Joints,” ASME J. Electron. Packag., 118.
Iannuzzelli,  R. J., Pitarresi,  J. M., and Prakash,  V., 1996, “Solder Joint Reliability Prediction by the Integrated Matrix Creep Method,” ASME J. Electron. Packag., 118.
Gilleo, K., ed., 1992, Handbook of Flexible Circuits, Van Nostrand Reinhold, New York.
Juskey, F., and Carson, R., 1997, “DCA on Flex: A Low Cost/Stress Approach,” E. Suhir et al., eds., Advances in Electronic Packaging, ASME Press.
Suhir,  E., 1994, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule,” J. Lightwave Technol., 12(10).
Suhir, E., 2001, “Arrangement for Reducing Bending Stress in an Electronics Package,” U.S. Patent #6,180,241
Suhir, E., and Weld, J., 1997, “Electronic Package with Reduced Bending Stress,” US Patent #5,627,407.
Roll,  K., 1976, “Analysis of Stress and Strain Distribution in Thin Films and Substrates,” J. Appl. Phys., 47(7).
Olsen,  G. H., and Ettenberg,  M., 1977, “Calculated Stresses in Multilayered Heteroepitaxial Structures,” J. Appl. Phys., 48(6).
Vilms,  J., and Kerps,  D., 1982, “Simple Stress Formula for Multilayered Thin Films on a Thick Substrate,” J. Appl. Phys., 53(3).
Suhir,  E., 1988, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films,” ASME J. Appl. Mech., 55(10).
Suhir,  E., 1991, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics,” Int. J. Solids Struct., 27(8).
Suhir,  E., 1994, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate,” ASME J. Electron. Packag., 116(3).
Luryi,  S., and Suhir,  E., 1986, “A New Approach to the High-Quality Epitaxial Growth of Lattice—Mismatched Materials,” Appl. Phys. Lett., 49(3), July.
Suhir,  E., 1992, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers,” ASME J. Electron. Packag., 114(2).
Suhir,  E., 1997, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends,” ASME J. Appl. Mech., 64(1).
Suhir,  E., 1998, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Nonhomogeneous Adhesive Layer: Predicted Thermal Stresses in the Adhesive,” J. Reinf. Plast. Compos., 16(14).
Suhir,  E., 1999, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends: Predicted Thermal Stresses in the Adhesive Layer,” Compos. Interfaces, 6(2).
Suhir,  E., 2001, “Thermal Stress in a Polymer Coated Optical Glass fiber with a Low Modulus Coating at the Ends,” J. Mater. Res., 16(10).
Suhir,  E., and Sullivan,  T. M., 1990, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders,” Int. J. Solids Struct., 26(6).
Ganssan, G. S., and Berg, H., 1993, “Model and Analysis for Reflow Cracking Phenomenon in SMT Plastic Packages,” 43-rd IEEE ECTC.
EIA/JEDEC 1995, Standard, Test Method A112-A, “Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices,” Electronic Industries Association, Engineering Department. Arlington, VA.
Shin, D. K., and Lee, J. J., 1997, “A Study on the Mechanical Behavior of Epoxy Molding Compound and Thermal Stress Analysis in Plastic Packaging,” E. Suhir et al., Advances in Electronic Packaging 1997, vol. 1, ASME Press.
Suhir, E., 1993, “Predicted Bow of Plastic Packages of Integrated Circuit Devices,” J. H. Lau, ed., Thermal Stress and Strain in Microelectronic Packaging, Van Nostrand Reinhold, New York.
Suhir,  E., 1997, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains,” Int. J. Solids Struct., 34(12).
Suhir, E., 1997, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure,” IMAPS/NATO Workshop Proceedings, Bled, Slovenia.
Suhir,  E., 1998, “Fiber Optic Structural Mechanics—Brief Review,” ASME J. Electron. Packag., Sept.
Suhir, E., 1999, “Effect of Plastic Package Geopmetry on its Propensity to Moisture Induced Failure,” R. Tummala, M. Kosec, W. Kinzy Jones, and D. Belavic, eds., Electronic Packaging for High Reliability: Low Cost Electronics, NATO ASI Series, 3. “High Technology,” vol. 57, Kluwer Academic Publishers.
Uschitsky, M., and Suhir, E., 1996, “Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner,” Suhir, E., ed., Structural Analysis in Microelectronics and Fiber Optics, Symposium Proceedings, ASME Press, 1996.
Uschitsky,  M., Suhir,  E., and Kammlott,  G. W., 2001, “Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach,” ASME J. Electron. Packag., 123(4).
Suhir,  E., 1988, “Spring Constant In the Buckling of Dual-Coated Optical Fibers,” J. Lightwave Technol., 6(7).
Suhir,  E., and Segelken,  J. M., 1990, “Mechanical Behavior of Flip-Chip Encapsulants,” ASME J. Electron. Packag., 112(4).
Suhir,  E., and Manzione,  L. T., 1991a, “Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Moldings,” ASME J. Electron. Packag., 113(1).
Suhir,  E., and Manzione,  L. T., 1991b, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages During Molding,” ASME J. Electron. Packag., 113(4).
Suhir,  E., and Manzione,  L. T., 1992, “Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature,” ASME J. Electron. Packag., 114(3).
Suhir, E., 1996, “Flex Circuit vs Regular” Substrate: Predicted Reduction in the Shearing Stress in Solder Joints,” Proc., 3rd Int. Conf. on Flexible Circuits FLEXCON 96, San Jose, CA, Oct.
Suhir,  E., 1988b, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers,” J. Lightwave Technol., 6(8).
Suhir,  E., 1988, “Stresses in Dual-Coated Optical Fibers,” ASME J. Appl. Mech., 53(3), Sept.
Suhir, E., 1988f, “Calculated Stresses in Dual Coated Fibers,” Proc. Of the SPE 46-th Annual Technical Conference, ANTEC’88, Atlanta, GA.
Suhir,  E., 1990, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers,” J. Lightwave Technol., 8(6).
Suhir, E., 1998, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading,” Int. Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, November 29–December 2, 1998, ASME Press.
Suhir, E., 1998, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?” Int. Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29–Dec. 2, 1998, ASME Press.
Suhir, E., 2000, “Silica Optical Fiber Interconnects: Design for Reliability,” Proc. Annual Conference of the American Ceramic Society, St.-Louis, MO, May 3.
Suhir,  E., 2000, “Optical Fiber Interconnect with the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber,” J. Appl. Phys., 88(7).
Suhir,  E., 1992, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship,” Appl. Opt., 31(24).
Suhir,  E., 1993, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension,” Appl. Opt., 32(18).
Suhir,  E., and Vuillamin,  J. J., 2000, “Effects of the CTE and Young’s Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling,” Opt. Eng., 39(12).
Suhir,  E., 1998, “The Future of Microelectronics and Photonics, and the Role of Mechanics and Materials,” ASME J. Electron. Packag., Mar.
Suhir, E., 1999, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention,” Future Circuits International, Issue 5.
Suhir,  E., 2000, “Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review,” ASME J. Electron. Packag., 121(3).
Suhir,  E., 2000, “Microelectronics and Photonics—the Future,” Microelectronics J.,31(11–12).

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