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TECHNICAL PAPERS

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

[+] Author and Article Information
Masoud Darbandi

Department of Aerospace Engineering, Sharif University of Technology, Tehran, Irane-mail: darbandi@sharif.edu

Gerry E. Schneider

Department of Mechanical Engineering, University of Waterloo, Waterloo, ON, N2L 3G1 Canadae-mail: gerrys@uwaterloo.ca

J. Electron. Packag 125(2), 244-250 (Jun 10, 2003) (7 pages) doi:10.1115/1.1569508 History: Received September 27, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Figures

Grahic Jump Location
Typical arrangement for natural convection modeling
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EBE and IBE u velocity distributions at center grids, Ra=104
Grahic Jump Location
EBE and IBE u velocity distributions at center grids, Ra=105
Grahic Jump Location
EBE and IBE u velocity distributions at center grids, Ra=106
Grahic Jump Location
EBE and IBE v velocity distributions at center grids, Ra=104
Grahic Jump Location
EBE and IBE v velocity distributions at center grids, Ra=105
Grahic Jump Location
EBE and IBE v velocity distributions at center grids, Ra=106
Grahic Jump Location
EBE and IBE u velocity contour maps, Ra=104
Grahic Jump Location
EBE and IBE u velocity contour maps, Ra=105
Grahic Jump Location
EBE and IBE u velocity contour maps, Ra=106
Grahic Jump Location
EBE and IBE v velocity contour maps, Ra=104
Grahic Jump Location
EBE and IBE v velocity contour maps, Ra=105
Grahic Jump Location
EBE and IBE v velocity contour maps, Ra=106

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