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TECHNICAL PAPERS

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

[+] Author and Article Information
Alfonso Ortega

Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, Arizona 85721

Shankar Ramanathan

Center for Electronic Packaging Research, The University of Arizona, Tucson, Arizona 85721

J. Electron. Packag 125(2), 235-243 (Jun 10, 2003) (9 pages) doi:10.1115/1.1569507 History: Received March 26, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Figures

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Uniform flow over a heat source on a thin conducting plate—schematic representation of the problem
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Nondimensional temperature rise due to a square source for Peb=5 and ks/ke=1: (a) surface plot; (b) temperature contours on surface
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Nondimensional temperature rise due to a square source for Peb=500 and ks/ke=1—(a) surface plot; (b) temperature contours on surface
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Nondimensional temperature rise due to a square source for Peb=5 and ks/ke=10—(a) surface plot; (b) temperature contours on surface
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Nondimensional temperature rise due to a square source for Peb=500 and ks/ke=10—(a) surface plot; (b) temperature contours on surface
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Nondimensional centerline temperature rise due to a square source for Peb=5 and various ks/ke
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Nondimensional centerline temperature rise due to a square source for Peb=50 and various ks/ke
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Nondimensional centerline temperature rise due to a square source for Peb=500 and various ks/ke
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Correlation of Nub with Peb for various sources on adiabatic board
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Nub over a square source versus Peb for various ks/ke compared with adiabatic board correlation
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Nub difference from adiabatic board versus ks/ke for various Peb
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Nub correlation with ks/ke Peb and ks/ke versus Peb for various ks/ke
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Nub correlation for all Peb and ks/ke versus Peb
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Normalized average Nub versus Peb

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