0
TECHNICAL PAPERS

Fundamental Performance Limits of Heatsinks

[+] Author and Article Information
David Watabe Copeland

Fujitsu Laboratories of America, San Jose, CA 95134-1402e-mail: copeland@fla.fujitsu.com

J. Electron. Packag 125(2), 221-225 (Jun 10, 2003) (5 pages) doi:10.1115/1.1569262 History: Received August 06, 2001; Online June 10, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Knight,  R. W., Goodling,  J. S., and Hall,  D. J., 1991, “Optimum Design of Forced Convection Heat Sinks—Analytical,” ASME J. Electronic Packag., 113(3), pp. 313–321.
Azar, K., McLeod, R. S., and Caron, R. E., 1992, “Narrow Channel Heat Sink for Cooling of High Powered Electronic Components,” Proc Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 12–19.
Lee,  S., 1995, “Optimum Design and Selection of Heat Sinks,” IEEE Trans., Components, Packaging and Manufacturing Technology—Part A, 18, No. 4, pp. 812–817.
Biber, C. R., and Fijol, S., 1999, Fan—plus—Heatsink “Optimization”—Mechanical and Thermal Design with Reality, Proc Int Systems Packaging Symposium, pp. 12–19.
Teertstra, P., Yovanovich, M. M., Culham, J. R., and Lemczyk, T., 1999, “Analytical Forced Convection Modeling of Plate Fin Heat Sinks,” Proc., Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 34–41.
dos Reis, E., and Altemani, C. A. C., 1999, “Design of Heat Sinks and Planar Spreaders with Airflow Bypass, ASME EEP-Vol. 26-1,” Advances in Electronic Packaging—1999, pp. 477–484.
Copeland, D., 2000, “Optimization of Parallel Plate Heatsinks for Forced Convection,” Proc., Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 266–272.
Iyengar, M., and Bar-Cohen, A., 2000, “Design for Manufacturability of SISE Parallel Plate Forced Convection Heat Sinks,” Proc., Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 141–148.
de Kock, D. J., and Visser, J. A., “Optimal Heat Sink Design Using Mathematical Optimization,” Proceedings of The Pacific Rim/International Intersociety Electronic Packaging Conference, IPACK2001-15599

Figures

Grahic Jump Location
Finite conductivity heatsink: effect of NTU on volume flow rate constant overall dimensions and fan/blower power, various values of T
Grahic Jump Location
Finite conductivity heatsink: effect of NTU on fin spacing—constant overall dimensions and fan/blower power, various values of T
Grahic Jump Location
Finite conductivity heatsink: effect of NTU on fin thickness—constant overall dimensions and fan/blower power, various values of T
Grahic Jump Location
Finite conductivity heatsink: effect of NTU on thermal conductance—constant overall dimensions and fan/blower power, various values of T
Grahic Jump Location
Ideal heatsink: effect of fin spacing on heatsink effectiveness—constant frontal area and fan/blower power, various lengths
Grahic Jump Location
Ideal heatsink: effect of fin spacing on volume flow rate—constant frontal area and fan/blower power, various lengths
Grahic Jump Location
Ideal heatsink: effect of fin spacing on number of transfer units—constant frontal area and fan/blower power, various lengths
Grahic Jump Location
Ideal heatsink: effect of fin spacing on thermal conductance—constant frontal area and fan/blower power, various lengths
Grahic Jump Location
Finite conductivity heatsink: effect of NTU on heatsink weight—constant overall dimensions and fan/blower power, various values of T
Grahic Jump Location
Finite conductivity heatsink: effect of NTU on fan/blower power—constant overall dimensions and thermal conductance, various values of T

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In