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TECHNICAL PAPERS

Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

[+] Author and Article Information
Y. S. Muzychka

Faculty of Engineering and Applied Science, Memorial University of Newfoundland, St. John’s, Newfoundland, Canada A1B 3X5

J. R. Culham, M. M. Yovanovich

Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, Canada N2L 3G1

J. Electron. Packag 125(2), 178-185 (Jun 10, 2003) (8 pages) doi:10.1115/1.1568125 History: Received February 26, 2002; Online June 10, 2003
Copyright © 2003 by ASME
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References

Ellison, G., 1984, Thermal Computations for Electronic Equipment, Krieger Publishing, Malabar, FL.
Kokkas,  A., 1974, “Thermal Analysis of Multiple-Layer Structures,” IEEE Trans. Electron Devices, Ed-21(14), pp. 674–680.
Hein, V. L., and Lenzi, V. D., “Thermal Analysis of Substrates and Integrated Circuits,” pp. 166–177, Bell Telephone Laboratories, unpublished report.
Maple V Release 6, 2000, Waterloo Maple Software, Waterloo, ON, Canada.
Mathcad Release 6, 1995, Mathsoft Inc., Cambridge, MA.
Mathematica, 1996, Release 3, Wolfram Research, Champaign-Urbana, IL.
MatLab Release 4, 1997, Mathworks Inc., Natick, MA.
Yovanovich, M. M., 1998, “Chapter 3: Conduction and Thermal Contact Resistance (Conductance),” Handbook of Heat Transfer, eds., W. M. Rohsenow, J. P. Hartnett, and Y. L. Cho, McGraw-Hill, New York, NY.
Verziroglu,  T. N., and Chandra,  S., 1969, “Thermal Conductance of Two Dimensional Constrictions,” Prog. Astronaut. Aeronaut., Vol. 21 Thermal Design Principles of Spacecraft and Entry Bodies, ed., G. T. Bevins, pp. 617–620.
Krane,  M. J. H., 1991, “Constriction Resistance in Rectangular Bodies,” ASME J. Electron. Packag., 113, pp. 392–396.
Yovanovich,  M. M., Muzychka,  Y. S., and Culham,  J. R., 1999, “Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels,” J. Thermophys. Heat Transfer, 13, pp. 495–500.
Arpaci, V., 1966, Conduction Heat Transfer, Addison-Wesley, New York, NY.
Carslaw, H. S., and Jaeger, J. C., 1959, Conduction of Heat in Solids, Oxford University Press, Oxford, UK.
Ozisik, N. A., 1980, Heat Conduction, John Wiley and Sons, Inc., New York, NY.
Luikov, A. V., 1968, Analytical Heat Diffusion Theory, Academic Press, New York, NY.
Culham, J. R., and Yovanovich, M. M., 1997, “Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution,” The Pacific Rim/ASME International, Intersociety Electronic and Photonic Packaging Conference, INTERpack ’97, Kohala Coast, Island of Hawaii, June 15–19.

Figures

Grahic Jump Location
Isotropic plate with eccentric heat source
Grahic Jump Location
Compound plate with eccentric heat source
Grahic Jump Location
Special cases of a plate with eccentric heat source
Grahic Jump Location
Isotropic plate with central heat source
Grahic Jump Location
Compound plate with central heat source
Grahic Jump Location
Plate with multiple heat sources
Grahic Jump Location
Surface temperature for an isotropic plate with two heat sources
Grahic Jump Location
Surface temperature for a compound plate with two heat sources
Grahic Jump Location
Surface temperature for a heat sink with four heat sources
Grahic Jump Location
Surface temperature for a complex heat source

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