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TECHNICAL BRIEFS

Thermoelectric Behavior of Solder

[+] Author and Article Information
Taejin Kim, D. D. L. Chung

Composite Materials Research Laboratory, University at Buffalo, The State University of New York, Buffalo, NY 14260-4400

J. Electron. Packag 125(1), 161-162 (Mar 14, 2003) (2 pages) doi:10.1115/1.1536952 History: Received February 28, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Roberts,  R. B., 1985, “Absolute Thermopower of Pb, Cu, and Pt,” CODATA Bull., 59, pp. 47–49.

Figures

Grahic Jump Location
Measured Seebeck voltage versus temperature difference during heating and subsequent cooling
Grahic Jump Location
Absolute thermoelectric power versus temperature difference during heating and subsequent cooling

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