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TECHNICAL BRIEFS

Open Defects in PBGA Assembly Solder Joints

[+] Author and Article Information
S. H. Fan, Y. C. Chan

Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong

J. K. L. Lai

Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong

J. Electron. Packag 125(1), 157-161 (Mar 14, 2003) (5 pages) doi:10.1115/1.1536951 History: Received March 19, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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Cross section view of open defect occurred between the solder and IMC layer
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(a) The conventional reflow profiles, and (b) adjusted reflow profiles for PBGA assemblies
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Cross section view of open defect occurred between solder ball and solder paste on the PCB side; (a) failed solder joint, (b) failed solder joint row
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Optical photo of the misaligned failed solder joint viewed from the lateral side
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Cross section view of open defect occurred between solder paste and solder ball on the PBGA side
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Optical views of an open defect solder joint on (a) PBGA, and (b) PCB sides after the PBGA was detached
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Optical view of re-soldering PCB solder pads corresponding to Fig. 6(b)
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Optical view shows open solder defect caused by the incoming PBGA component
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Optical view shows contamination on PCB solder pad that results in open solder joint defect
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X-ray photo shows open defect solder joints
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Optical cross section view of the eighth solder joint row from left in Fig. 10
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Optical cross section view shows the nearly open solder joint

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