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TECHNICAL BRIEFS

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

[+] Author and Article Information
Y. C. Chan, S. H. Fan

Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong

J. K. L. Lai

Department of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong

J. Electron. Packag 125(1), 153-156 (Mar 14, 2003) (4 pages) doi:10.1115/1.1537070 History: Received March 19, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

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Fan,  S. H., Chan,  Y. C., and Lai,  J. K. L., 2001, “Fatigue Lifetimes of PBGA Solder Joints Reflowed at different Conveyor Speeds,” ASME J. Electron. Packag., 123(3), pp. 290–294.
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Figures

Grahic Jump Location
Typical reflow temperature profile measured near the solder (Ts) and in the ambient gas (T)
Grahic Jump Location
Growth of IMC thickness of solder joints vs. square root of aging days; (a) aged at 80°C, (b) 125°C, (c) 160°C.
Grahic Jump Location
Optical microstructures (×400) of solder alloy reflowed by (a) profile no. 1, (b) profile no. 2, (c) profile no. 3.
Grahic Jump Location
Optical microstructures (×200) of solder alloy reflowed by profile no. 1
Grahic Jump Location
Schematic of steady-state diffusion through a sheet that perpendicular to the grain boundaries
Grahic Jump Location
The relative magnitudes of Db(δ/d),Dl, and Dapp versus temperature

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