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TECHNICAL PAPERS

Finite Element Analysis of Mechanical Shock Responses of RF Connectors

[+] Author and Article Information
Z. Y. Zhu, H. P. Lee, B. T. Cheok

Institute of High Performance Computing, Singapore Science Park II, Singapore 117528

J. Electron. Packag 125(1), 144-152 (Mar 14, 2003) (9 pages) doi:10.1115/1.1536950 History: Received February 25, 2002; Revised April 12, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Steinberg, D. S., 1973, Vibration Analysis of Electronic Equipment, Wiley, New York, NY.
Suhir, E., and Lee, Y. C., 1990, “Thermal, Mechanical, and Environmental Durability Design Methodologies,” Electronic Materials Handbook, Vol. 1, Packaging, ASM International.
Corg, V. K., and Smolik, F., 1989, Vibration Fatigue Life Evaluation of Electronic Equipment, ASME Winter Annual Meeting, San Francisco, CA.
Allen,  A. M., and Bogy,  D. B., 1996, “Effects of Shock on the Head-Disk Interface,” IEEE Trans. Magn., 32(5), pp. 3717–3719.
Goyal,  S., Papadopoulos,  J. M., and Sullivan,  P. A., 1997, “Shock Protection of Portable Electronic Products: Shock Response Spectrum, Damage Boundary Approach, and Beyond,” Shock and Vibration,4(3), pp. 169–191.
Chalmers, R. H., 1998, Shock and Vibration Handbook, McGraw-Hill, Chap. 26, New York, NY.
Suhir,  E., 1992, “Nonlinear Dynamic Response of a Printed Circuit Board to Shock loads Applied to Its Support Contour,” ASME J. Electron. Packag., 114, Dec., pp. 368–377.
Suhir,  E., 1996, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19(3), pp. 435–440.
Military Standard, 1982, Mil-Std-883D, Method 2002.3, Mechanical Shock, US Dept. of Defense.
ABAQUS, 1998, Theory Manual Version 5.8, Hibbit, Karlsson & Sorensen, Inc., USA.
ABAQUS, 1998, User’s Manual Version 5.8, Hibbit, Karlsson & Sorensen, Inc., USA.
Newton, R. E., 1988, Shock and Vibration Handbook, McGraw-Hill, Chap. 31, New York, NY.

Figures

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Shaded plot and dimension of an RF connector
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A three-dimensional finite element model of the pin (right) and terminal (left)
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Stress-strain curve for phosphorus bronze
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Shock profile plot (a) half-sine, (b) rectangular, (c) triangular
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Von Mises stresses (MPa) plotting of the top surface (inserted)
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Von Mises stresses (MPa) plotting of the top surface (after shock, 1500 g)
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Equivalent plastic strain plotting of top surface—(a) before shock, (b) after shock (1500 g)
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Contact force in shock simulation
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Contact force versus time (top and bottom surfaces of terminal)—(a) added mass 0.04 g, (b) added mass 0.4 g
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Terminal damaged. (added mass 2 g); original shape is below, deformed shape is on top
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Contours of von Mises stresses in the terminal (added mass 0.04 g and 0.4 g)—(a) top surface, (b) bottom surface
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Contours of maximum principal stresses in the terminal (added mass 0.04 g and 0.4 g)—(a) top surface, (b) bottom surface
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Contact force plot for different shock profiles (original model)
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Contact force plot for different shock profiles (model with an added mass of 0.4 g)
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Typical acceleration pulse with maximum acceleration amax and duration τ. The shaded area represents the resulting velocity change vc. The dashed rectangle represents an equivalent rectangular pulse of duration τr having the same velocity change vc.
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Shock profile of three consecutive triangular shock pulses
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Contact force plot for consecutive triangular shock profiles
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Directions of the shocks for the shock tests

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