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TECHNICAL PAPERS

An Efficient Solution for Wire Sweep Analysis in IC Packaging

[+] Author and Article Information
Jerry Su, Sheng-Jye Hwang

Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan

Francis Su, Shou-Kang Chen

ChipMOS TECHNOLOGIES INC., Tainan, Taiwan

J. Electron. Packag 125(1), 139-143 (Mar 14, 2003) (5 pages) doi:10.1115/1.1535447 History: Received April 12, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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User interface of InPack
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Detailed job functions and process flow of InPack
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Chip and leadframe assembly of TSOP II 40/44L package (epoxy flows from left to right, number beside the wire indicates the wire number)
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Wire sweep X-ray photo of TSOP II 40/44L package
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Averaged experimental measured wire sweep index of TSOP II 40/44L package
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Combine comparison of calculated results versus measured values for TSOP II 40/44L package
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Simulated wire sweep in graphic presentation for TSOP II 40/44L package (magnified at a scale of 10)
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Coordinate system used in Lamb’s model
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Flow charts for wire sweep analysis provided by C-MOLD Microchip Encapsulation Solution and InPack (Gray icons represent the analysis method used in this paper)

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