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TECHNICAL PAPERS

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

[+] Author and Article Information
Yujun Wen, Cemal Basaran

UB Electronic Packaging Laboratory, University at Buffalo, SUNY

J. Electron. Packag 125(1), 134-138 (Mar 14, 2003) (5 pages) doi:10.1115/1.1535446 History: Received January 28, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

Grahic Jump Location
Generic laminated beam-type plate
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Geometry and material properties of the analyzed structure
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Comparison of peeling stress at interface 1 between FEM and analytical solution
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Comparison of shear stress at interface 2 between FEM and analytical solution
Grahic Jump Location
Comparison of peeling stress at interface 1 between FEM and analytical solution
Grahic Jump Location
Comparison of peeling stress at interface 2 between FEM and analytical solution

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