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TECHNICAL PAPERS

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

[+] Author and Article Information
Suman Chakraborty

Department of Mechanical Engineering, Indian Institute of Technology, Kharagpur 721302, Indiae-mail: sumanc@mech.iitgp.ernet.in

Pradip Dutta

Department of Mechanical Engineering, Indian Institute of Science, Bangalore 560012, Indiae-mail: pradip@mecheng.iisc.ernet.in

J. Electron. Packag 125(1), 126-133 (Mar 14, 2003) (8 pages) doi:10.1115/1.1535445 History: Received January 23, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

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Xie,  J., and Kar,  A., 1997, “Mathematical Modelling of Melting during Laser Materials Processing,” J. Appl. Phys., 81, pp. 3015–3022.
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Arpai, V. S., 1966, Conduction Heat Transfer, Addison-Wesley, Reading, MA.
Shah, R. K., and Bhatti, M. S., 1987, “Laminar Convective Heat Transfer in Ducts,” eds. S. Kakac, R. K. Shah, and W. Aung, Handbook of Single-Phase Convective Heat Transfer, Wiley, New York, NY.
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Lacroix,  M., 1993, “Numerical Simulation of a Shell-and-tube Latent Heat Thermal Energy Storage Unit,” Sol. Energy, 50, pp. 357–367.

Figures

Grahic Jump Location
A schematic diagram of the generic problem
Grahic Jump Location
Mathematical model of the generic problem
Grahic Jump Location
Temperature distribution for the first test problem
Grahic Jump Location
Temperature distribution for the second test problem

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