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TECHNICAL PAPERS

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

[+] Author and Article Information
Hong Tang

NEC Electronics Corporation, Detroit, MI

Cemal Basaran

UB Electronic Packaging Laboratory, University at Buffalo, SUNY, Buffalo, NY 14260e-mail: cjb@eng.buffalo.edu

J. Electron. Packag 125(1), 120-125 (Mar 14, 2003) (6 pages) doi:10.1115/1.1536171 History: Received December 10, 2001; Online March 14, 2003
Copyright © 2003 by ASME
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References

Zhao,  Y., Basaran,  C., Cartwright,  A., and Dishongh,  T., 1999, “Thermomechanical Behavior of Micron Scale Solder Joints: an Experiment Observation,” J. Mech. Behav. Mater., 10, pp. 135–146.
Busso,  E. P., Kitano,  M., and Kamazawa,  M., 1992, “A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints,” ASME J. Eng. Mater. Technol., 114, pp. 331–337.
Dasgupta,  A., Oyan,  C., Barker,  D., and Pecht,  M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME J. Electron. Packag., 114, pp. 152–160.
Frear, D., Morgan, H., Burchett, S., and Lau, J., 1994, The Mechanics of Solder Alloy Interconnects. Chapman & Hall, New York, NY.
McDowell,  D. L., Miller,  M. P., and Brooks,  D. C., 1994, “A Unified Creep-plasticity Theory for Solder Alloys,” Fatigue Testing of Electronic Materials, ASTM Spec. Tech. Publ., 1153, pp. 42–59.
Basaran,  C., Desai,  C. S., and Kundu,  T., 1998, “Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part I: Theory and formulation,” ASME J. Electron. Packag., 120(1), pp. 41–47.
Basaran,  C., Desai,  C. S., and Kundu,  T., 1998, “Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part II: Verification and Application,” ASME J. Electron. Packag., 120(1), pp. 48–54.
Chow, C. L., and Yang, F., 1998, “Damage Mechanics Characterization on Fatigue Behavior of a Solder Joint Material,” Proc., ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, pp. 1–13
Basaran,  C., and Chandaroy,  R., 1998, “Mechanics of Pb40/Sn60 Near-eutectic Solder Alloys Subjected to Vibration,” Appl. Math. Model., 22, pp. 601–627.
Qian,  Z., Ren,  W., and Liu,  S., 1999, “A damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys,” ASME J. Electron. Packag., 21, pp. 162–168.
Desai, C., and Siriwardane, H. 1994, Constitutive Laws for Engineering Materials, Prentice Hall.
Basaran,  C., Yan,  C., 1998, “A Thermodynamic Framework for Damage Mechanics of Solder Joints,” ASME J. Electron. Packag., 120, pp. 379–384.
Stone, D. S., and Rashid, M. M. 1994, “Constitutive Models,” Chap. 4, The Mechanics of Solder Alloys, Interconnect, Chapman-Hall.
Kashyap,  P. and Murty,  G. S., 1981, “Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy,” J. Mater. Sci., 50, pp. 205–213.
Smithells, C. J., 1983, Metals Reference Book, Brandes, 6th Edition.
Friedel, J., 1964, Dislocations, Pergamon Press.
Armstrong, P. J., and Frederick, C. O., 1996, “A Mathematical Representation of the Multiaxial Bauschinger Effect,” G.E.G.B. Report RD/B/N731
Chaboche,  J. L., 1989, “Constitutive Equations for Cyclic Plasticity and Viscoplasticity,” Int. J. Plast., 5, pp. 247–302.
Kachanov, L. M., 1986, Introduction of Continuum Damage Mechanics, Nijhoff (Martinus), Dordrecht.
Robotnov, Y. N., 1969, “Fundamental Problems in Visco-Plasticity,” Recent Advances in Applied Mechanics, Academic Press, New York, NY.
Valanis,  K. C., 1997, “Some Thoughts on Thermodynamics of Internal Variables,” Arch. Mech., 49(2), pp. 443–445.
Chaboche,  J. L., and Lesne,  P. M., 1988, “A Non-Linear Continuous Fatigue Damage Model,” Fatigue Fract. Eng. Mater. Struct. 11, pp. 1–17.
Murakami,  S., 1988, “Mechanical Modeling of Material Damage,” ASME J. Appl. Mech., 55, pp. 280–286.
Krajcinovic,  D., 1989, “Damage Mechanics,” Mech. Mater., 8, pp. 117–197.
Ju,  J. W., 1989, “On Energy-Based Coupled Elastoplastic Damage Theories: Constitutive Modeling and Computational Aspects,” Int. J. Solids Struct., 25(7), pp. 803–833.
Lemaitre, J. 1990, A Course on Damage Mechanics, Springer LS-DYNA, 1998. LS-DYNA version 940.2 KBS2, Inc.
Bazant,  Z. P., 1991, “Why Continuum Damage is Nonlocal: Micromechanics Arguments,” J. Eng. Mech. Div., 117(5), pp. 1070–1087.
Chow,  C. L., and Chen,  X. F., 1992, “An Anisotropic Model of Damage Mechanics Based on Endochronic Theory of Plasticity,” Int. J. Fract., 55, pp. 115–130.
Voyiadjis, G. Z., and Thisgarajan, G., 1996, “A Damage Cyclic Model for Metal Matrix Composites,” Damage and Interface Debonding in Composites, Voyiadjis and Allen, eds., Elsevier, New York, NY.
Solomon,  H. D., and Tolksdorf,  E. D., 1996, “Energy Approach to the Fatigue of 60/40 Solder: Part II-Influence of Hold Time and Asymmetric Loading.” ASME J. Electron. Packag., 188, pp. 67–71.
Adams, P. J., 1986, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M.S. thesis, Department of Mechanical Engineering, MIT, Cambridge, MA.
Skipor,  A. F., Harren,  S. V., and Botsis,  J., 1996, “On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,” ASME J. Eng. Mater. Technol., 118, pp. 1–11.
Solomon,  H. D., 1989, “Strain-Life Behavior in 60/40 Solder,” ASME J. Electron. Packag., 111, pp. 75–82.
Basaran,  C., and Zhao,  Y., “Mesh Sensitivity and FEA for Multilayered Electronic Packaging” ASME J. Electron. Packag., 123, No. ( 3), pp. 218–224.
Zhao,  Y., Basaran,  C., Cartwright,  A., and Dishongh,  T., 2000, “Thermomechanical Behavior of Micron Scale Solder Joints under Dynamic Loads,” Mech. Mater., 32(3), pp. 161–173.

Figures

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Uniaixial extension simulation (solid lines) versus Adams’s test under strain rate 1.67E-2 and different temperature
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Uniaixial extension simulation (solid lines) versus Skipor’s test under strain rate 1.0E-1 and different temperature
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Uniaixial extension simulation (solid lines) versus McDowell’s test under strain rate 1.0E-2 and different temperature
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Strain-stress hysteresis loop curves for 20, 100, 400, 700 cycles (inelastic strain range=0.04,35°C)
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Strain-stress hysteresis loop curves for 1010 cycles and damage evolution time-history (inelastic strain range=0.04,35°C)
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Strain-stress hysteresis loop curves for 20, 100, 600, 1100 cycles (inelastic strain range=0.03,35°C)
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Strain-stress hysteresis loop curves for 1010 cycles and damage evolution time-history (inelastic strain range=0.03,35°C)
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Strain-stress hysteresis loop curves for 20,100,600,1500 cycles, (inelastic strain range=0.025,35°C)
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Strain-stress hysteresis loop curves for 2000 cycles and damage evolution time-history (inelastic strain range=0.025,35°C)
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Comparison of fatigue life (Solomon’s test versus FEM)
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Cross section of BGA electronic package
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The thermal loading profile of one cycle
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Shear strain after two and four thermal cycles (with damage model implemented into ABAQUS)
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Shear strain after six and eight thermal cycles (with damage model implemented into ABAQUS)
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Shear strain after 10 thermal cycles (with damage model implemented into ABAQUS)
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Comparison of finite element simulation results with Moiré interferometry test data
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Damage distribution after two and four thermal cycles (with damage model implemented into ABAQUS)
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Damage distribution after six and eight thermal cycles (with damage model implemented into ABAQUS)
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Damage distribution after 10 thermal cycles (with damage model implemented into ABAQUS)
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The evolution of maximum damage under 10 thermal cycles (with damage model implemented into ABAQUS)

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