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TECHNICAL PAPERS

The Strength of the Silicon Die in Flip-Chip Assemblies

[+] Author and Article Information
B. Cotterell

Institute of Materials Research and Engineering, Singapore 117602

Z. Chen

School of Materials Engineering, Nanyang Technological University, Singapore 639798

J.-B. Han, N.-X. Tan

Agilent Technologies Singapore Pte. Ltd., Singapore 618494

J. Electron. Packag 125(1), 114-119 (Mar 14, 2003) (6 pages) doi:10.1115/1.1535934 History: Received December 27, 2001; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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Silicon die cracks in flip chip assemblies—(a) cracks from surface defects, (b) cracks from edge defects
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The four-point-bend test
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The probability of fracture from surface defects in the ring-on-ring test
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The probability of fracture in the four-point-bend test
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The best estimates of the population probability of fracture for the four-point-bend test
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A large edge defect caused by dicing
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The size effect on the probability of fracture of a hypothetical uniformly stressed silicon die
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The finite element mesh

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