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TECHNICAL PAPERS

The Strength of the Silicon Die in Flip-Chip Assemblies

[+] Author and Article Information
B. Cotterell

Institute of Materials Research and Engineering, Singapore 117602

Z. Chen

School of Materials Engineering, Nanyang Technological University, Singapore 639798

J.-B. Han, N.-X. Tan

Agilent Technologies Singapore Pte. Ltd., Singapore 618494

J. Electron. Packag 125(1), 114-119 (Mar 14, 2003) (6 pages) doi:10.1115/1.1535934 History: Received December 27, 2001; Online March 14, 2003
Copyright © 2003 by ASME
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References

Ranjan, M., Gopalakrishnan, L., Srihan, K., and Woychik, 1998, “Die Cracking in Flip Chip Assemblies,” Proc., 48th Electronic Components and Technology Conference, Seattle, WA, pp. 729–733.
Leung, B., Guo, Y., and Sarihan, V., 1997, “Die Strength in the Presence of Edge Cracks,” Application of Fracture Mechanics in Electronic Packaging, eds., W. T. Chen and D. T. Read, ASME, AMD-Vol 222, pp. 125–131.
Popelar, S. F., 1998, “An Investigation into the Fracture of Silicon Die Used in Flip Chip Applications,” Proc., Int. Symp. Advanced Packaging Materials, pp. 41–48.
Chen,  C. P., and Leipold,  M. H., 1980, “The Fracture Toughness of Silicon,” Ceram. Bull., 59, pp. 469–472.
Weibull, W., 1939, Statistical Theory of Strength of Materials, Ingeniors Vetenskaps. Akademien, Handkinger No 151.
Jayatilaka,  A. De S., and Trustrum,  K., 1977, “Statistical Approach to Brittle Fracture,” J. Mater. Sci., 12, pp. 1426–1430.
Trustrum,  K., and Jaytilaka,  A. De S., 1979, “On Estimating the Weibull Modulus for a Brittle Material,” J. Mater. Sci., 14, pp. 1080–1084.
Bergman,  B., 1986, “Estimation of Weibull Parameters Using a Weight Function,” J. Mater. Sci. Lett., 5, pp. 611–614.
Langlois,  R., 1991, “Estimation of Weibull Parameters,” J. Mater. Sci. Lett., 10, pp. 1049–1051.
Absi,  J., Fournier,  P., and Glandis,  J. C., 1999, “Influence of Experimental Parameters on the Estimation of Weibull’s Modulus,” J. Mater. Sci., 34, pp. 1219–1227.
Mason, W. P., 1958, Physical Acoustics and the Properties of Solids, Van Nostrand.

Figures

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Silicon die cracks in flip chip assemblies—(a) cracks from surface defects, (b) cracks from edge defects
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The four-point-bend test
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The probability of fracture from surface defects in the ring-on-ring test
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The probability of fracture in the four-point-bend test
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The best estimates of the population probability of fracture for the four-point-bend test
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A large edge defect caused by dicing
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The size effect on the probability of fracture of a hypothetical uniformly stressed silicon die
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The finite element mesh

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