0
TECHNICAL PAPERS

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

[+] Author and Article Information
Chang-Yuan Liu, Ying-Huei Hung

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan

J. Electron. Packag 125(1), 104-113 (Mar 14, 2003) (10 pages) doi:10.1115/1.1536170 History: Received December 21, 2001; Online March 14, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, Washington, DC.
Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers, 3rd Edition, McGraw-Hill, New York, NY.
LaHaye,  P. G., Neugebauer,  F. J., and Sakhuja,  R. K., 1974, “A Generalized Prediction of Heat Transfer Surfaces,” ASME J. Heat Transfer, 96, pp. 511–517.
Hung, Y. H., and Chun, Y. H., 1994, “Thermal Performance Analysis of Cold Plates for Multi-Layer Structures with Arbitrary Heating Loads,” ASME HTD-Vol. 292, Heat Transfer in Electronic System, pp. 137–144.
Hung, Y. H., and Chiou, Y. M., 1996, “Computer-Aided Design for Multi-Layer Cold Plates with Arbitrary Heating Loads,” Proc., Technical Conference, 1996 International Electronics Packaging Society Conference, Austin, TX, September 29-October 1, pp. 285–296.
Wang, L. S., Liu, C. Y., and Hung, Y. H., 1998, “Thermal Computer-Aided Design for Multi-Layer Structures Integrated with Cold Plate,” Proc., Eleventh International Symposium on Transport Phenomena (ISTP-11), November 29-December 3, pp. 17–22.
Hung, Y. H., and Chen Y. Y., and Liu, C. Y, 1999, “Thermal CAD Package for Multilayer Printed Circuit Boards Integrated with Two-Stack Cold Plate,” Advances in Electronic Packaging-1999, ASME EEP-Vol. 26-2, pp. 2177–2184.
Sathe, S. B., Stutzman, R. J., and Kosteva, S. J., 1994, “Development of a High Performance Low Pressure Drop Water Cold-Plate for Electronic Packaging Applications,” ASME HTD- Vol. 292, Heat Transfer in Electronic System, pp. 123–128.
Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, van Nostrand Reinhold Co., New York, NY
Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in Single-Sample Experiments,” Mech. Eng. (Am. Soc. Mech. Eng.), pp. 3–8.
Moffat,  R. J., 1988, “Describing the Uncertainties in Experimental Results,” Exp. Therm. Fluid Sci., 1, pp. 3–17.
Piper, R. J., and Kraus, A. D., 1995, “Cold Plates with Asymmetric Heat Loading—Part I: The Single Stack,” ASME EEP-Vol. 10-2, Advances in Electronic Packaging, pp. 865–870.
Wang, M. P., 2000, “Forced Convective Heat Transfer in A Rectangular Hollow or Porous Channel,” Master’s thesis, Dept. of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Chapman, A. J., 1987, Fundamental of Heat Transfer, Macmillan Publishing Company, New York, NY, pp. 295–296, 302–304.

Figures

Grahic Jump Location
Multilayer structure integrated with a compact cold plate
Grahic Jump Location
Schematic of overall experimental setup with relevant instruments
Grahic Jump Location
Test block of compact cold plate—(a) coordinate system; (b) geometric dimensions and T/C installation locations
Grahic Jump Location
Parametric effects on local normalized temperature rises at Y/W=0.5—(a) effect of chip heat flux; (b) effect of air mass flow rate
Grahic Jump Location
Parametric effects on isotherms on cold plate surface—(a) effect of chip heat flux; (b) effect of air mass flow rate
Grahic Jump Location
Parametric effects on average temperature rise
Grahic Jump Location
Parametric effects on maximum and average thermal resistances of cold plate
Grahic Jump Location
Parametric effects on average Nusselt number
Grahic Jump Location
Ratio of heat transfer enhancement of using compact cold plate
Grahic Jump Location
Parametric effects on overall pressure drop of cold plate
Grahic Jump Location
j and f factors of cold plate
Grahic Jump Location
Colburn analogy of cold plate

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In