Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

[+] Author and Article Information
Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China

J. Electron. Packag 125(1), 84-92 (Mar 14, 2003) (9 pages) doi:10.1115/1.1533802 History: Received January 25, 2002; Revised March 15, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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Photographs of D type test chip (a), and FR4 printed circuit board (b)
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Schematic illustration of the flip-chip packages used in this study; unit: μm
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3-D FE meshes for flip-chip package (a), and a local view including the solder joint (b)
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Microstructure and crack in solder joints for small pitch B type flip-chip package with underfill—(a) original microstructure of solder joint before thermal cycling, (b) microstructure coarsening after 348 thermal cycles, and (c) crack formation after failure
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Acoustic images of underfilled flip chip package of large pitch D type after thermal cycles tests—(a) after 948 cycles, (b) 2451 cycles
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Dependence of delamination percentage on number of thermal cycles for small pitch B type package
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Stress-strain hysteresic loops in xz direction of large pitch D type with underfill  
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Relationships between strain ranges and thermal fatigue cycles from Coffin-Manson equation
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Equivalent plastic strain of solder joints at −55°C for large pitch D type flip chip—(a) without underfill, (b) with underfill. (Solder ball 1 is the nearest while solder ball 6 is the furthest to the center of the chip.)
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Equivalent plastic strain distribution of the furthest solder joint at −55°C for type D with underfill
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Chip deformation in 3-D simulation for B type flip-chip assembly with underfill
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Stress distribution of B type assembly with underfill after cooling from 125 to 5°C (a) for overall assembly simulated, and (b) for chip/underfill interface




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