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TECHNICAL PAPERS

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

[+] Author and Article Information
Peter J. Rodgers, Valérie C. Eveloy, Mark R. Davies

Electronics Thermal Management, Ltd., Upper Quay, Westport, Co. Mayo, IrelandDepartment of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Irelande-mail: mark.davies@ul.ie

J. Electron. Packag 125(1), 76-83 (Mar 14, 2003) (8 pages) doi:10.1115/1.1533060 History: Received March 09, 2000; Revised March 01, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Rodgers, P., 2000, “An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer,” Ph.D. thesis, Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland.
Rodgers, P., Eveloy, V., Lohan, J., Fager, C. M., Tiilikka, P., and Rantala, J., 1999, “Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments,” Proc., Fifteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XV), pp. 55–64.
Rodgers, P., Lohan, J., Eveloy, V., Fager, C. M., and Rantala, J., 1999, “Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Air Flows by Experimental Analysis,” Advances in Electronic Packaging; Proceedings of The PACIFIC RIM/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK’99), EEP-Vol. 26-1, pp. 999–1009.
Mack,  B., and Venus,  T., 2000, “Thermal Challenges in the Telecom and Networks Industry,” Electronics Cooling, 6 , No. 2, pp. 44–49.
Lasance,  C. J. M., 1995, “The need for a change in Thermal Design Philosophy,” Electronics Cooling, 1 (2), pp. 24–26.
Lohan, J., Tiilikka, P., Rodgers, P., Fager, C. M., and Rantala, J., 2000, “Using Experimental Analysis to Evaluate the Influence of Printed Circuit Board Construction on the Thermal Performance of Four Package Types in both Natural and Forced Convection,” Proc., Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM’2000), pp. 213–225.
Lohan,  J., Tiilikka,  P., Rodgers,  P., Fager,  C. M., and Rantala,  J., 2000, “Experimental and Numerical Investigation into the Influence of Printed Circuit Board Construction on Component Operating Temperature in Natural Convection,” IEEE Trans. Components and Packaging Technology (CPT), 23 (3).
Lohan, J., Tiilikka, P., Fager, C. M., and Rantala, J., 2000, “Effect of Both PCB Thermal Conductivity and Nature of Forced Convection Environment on Component Operating Temperature: Experimental Measurement and Numerical Prediction,” Proc., Sixteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XVI).
Eveloy,  V., Lohan,  J., and Rodgers,  P., 2000, “A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer,” IEEE Trans. Components and Packaging Technology (CPT), 23 (3), pp. 568–577.
Burgos,  J., Manno,  V. P., and Azar,  K., 1995, “Achieving Accurate Thermal Characterization Using a CFD Code—A Case Study of Plastic Packages,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18(4), pp. 732–738.
Anderson,  A., 1997, “A Comparison of Computational and Experimental Results for Flow and Heat Transfer from an Array of Heated Blocks,” ASME J. Electron. Packag., 119, Mar. pp. 32–39.
Rosten, H., Parry, J., Lasance, C., Vinke, H., Temmermann, W., Nelemans, W., Assouad, Y., Gautier, T., Slattery, O., Cahill, C., O’Flattery, M., Lacaze, C., and Zemlianoy, P., 1997, “Final Report to SEMITHERM XIII on the European-Funded Project DELPHI-the Development of Libraries and Physical Models for an Integrated Design Environment,” Thirteenth IEEE SEMI-THERM Symposium, pp. 73–91.

Figures

Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted PQFP208 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)
Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted TSOP 48 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)
Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted SO16 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)

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