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TECHNICAL PAPERS

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

[+] Author and Article Information
Peter J. Rodgers, Valérie C. Eveloy, Mark R. Davies

Electronics Thermal Management, Ltd., Upper Quay, Westport, Co. Mayo, IrelandDepartment of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Irelande-mail: mark.davies@ul.ie

J. Electron. Packag 125(1), 76-83 (Mar 14, 2003) (8 pages) doi:10.1115/1.1533060 History: Received March 09, 2000; Revised March 01, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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Figures

Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted SO16 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)
Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted TSOP 48 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)
Grahic Jump Location
Comparison of measured and predicted component-PCB surface temperature profiles for a single board mounted PQFP208 device in a 2 m/s air flow—(a) temperature profile through package center in the streamwise direction; (b) temperature profile through package center in the spanwise direction. (Note: Analysis planes defined in Part I. Uncertainty in temperature measurement=±0.7°C. Numerical analysis undertaken using Flotherm Version 2.1 with PCB FR-4 substrate thermal conductivity modeled as anisotropic.)

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