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TECHNICAL PAPERS

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

[+] Author and Article Information
Peter J. Rodgers, Valérie C. Eveloy

Electronics Thermal Management, Ltd., Upper Quay, Westport, Co. Mayo, Ireland

Mark R. D. Davies

Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Irelande-mail: mark.davies@ul.ie

J. Electron. Packag 125(1), 67-75 (Mar 14, 2003) (9 pages) doi:10.1115/1.1533059 History: Received March 09, 2000; Revised March 01, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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Figures

Grahic Jump Location
JEDEC Standard, low-thermal conductivity single-component test PCBs—(a) SO16, (b) TSOP 48, (c) PQFP 208. (Planes X and Y refer to spanwise and streamwise directions, respectively, for surface temperature profile analyses.)
Grahic Jump Location
Topology of multi-component test PCB showing component locations, copper tracking distribution and airflow direction
Grahic Jump Location
Wind tunnel, shown in horizontal orientation
Grahic Jump Location
Calibrated temperature corrections applied to infrared temperature measurements to account for radiative absorption properties of the low-density polyethylene (LDPE) film
Grahic Jump Location
SO16 component numerical model (quarter-geometry)
Grahic Jump Location
TSOP48 component numerical model (quarter-geometry)
Grahic Jump Location
PQFP208 component numerical model (quarter-geometry)
Grahic Jump Location
SO16 single-component PCB numerical model
Grahic Jump Location
TSOP48 single-component PCB numerical model
Grahic Jump Location
PQFP208 single-component PCB numerical model
Grahic Jump Location
Multi-component PCB numerical model

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