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TECHNICAL PAPERS

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

[+] Author and Article Information
Peter J. Rodgers, Valérie C. Eveloy

Electronics Thermal Management, Ltd., Upper Quay, Westport, Co. Mayo, Ireland

Mark R. D. Davies

Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Irelande-mail: mark.davies@ul.ie

J. Electron. Packag 125(1), 67-75 (Mar 14, 2003) (9 pages) doi:10.1115/1.1533059 History: Received March 09, 2000; Revised March 01, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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JEDEC Standard, low-thermal conductivity single-component test PCBs—(a) SO16, (b) TSOP 48, (c) PQFP 208. (Planes X and Y refer to spanwise and streamwise directions, respectively, for surface temperature profile analyses.)
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Topology of multi-component test PCB showing component locations, copper tracking distribution and airflow direction
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Wind tunnel, shown in horizontal orientation
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Calibrated temperature corrections applied to infrared temperature measurements to account for radiative absorption properties of the low-density polyethylene (LDPE) film
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SO16 component numerical model (quarter-geometry)
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TSOP48 component numerical model (quarter-geometry)
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PQFP208 component numerical model (quarter-geometry)
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SO16 single-component PCB numerical model
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TSOP48 single-component PCB numerical model
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PQFP208 single-component PCB numerical model
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Multi-component PCB numerical model

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