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TECHNICAL PAPERS

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

[+] Author and Article Information
Haruo Nose

Department of Mechanical Engineering for Transportation, Faculty of Engineering, Osaka Sangyo University, Osaka 574-8530, Japane-mail: nose@tm.osaka-sandai.ac.jp

Masao Sakane

Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, Shiga, 525-8577, Japane-mail: sakanem@se.ritsumei.ac.jp

Yutaka Tsukada, Hideo Nishimura

Packaging Technology Development, Yasu Technology Application Laboratory, IBM Japan, Shiga, 520-2392, Japan

J. Electron. Packag 125(1), 59-66 (Mar 14, 2003) (8 pages) doi:10.1115/1.1533058 History: Received November 30, 2000; Revised March 18, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Knecht,  S., and Fox,  L. R., 1990, “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(2), pp. 424–433.
Skipor,  A. F., Harren,  S. V., and Botsis,  J., 1996, “On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,” ASME JETMT, 118 , pp. 1–11.
Nose,  H., Sakame,  M., Tsukada,  Y., and Nishimura,  H., 1999, “Effect of Temperature and Strain Rate on Mechanical Property of Sn-Pb Solders,” Trans. JSME, A-65, pp. 901–908.
Yamamoto,  T., Sakane,  M., Ohnami,  M., and Yamada,  T., 1995, “Multiaxial Low Cycle Fatigue of 63Sn-37Pb Solder,” J. Materials Science Japan, 44 (503), pp. 1080–1085.
Plumbridge, W., 1998, private communication.
Takada, A., Sakane, M., Tsukada, Y., and Nishimura, H., 1998, “Creep and Creep Rupture Property of 63Sn-37Pb and 5Sn-95Pb Solders,” Proc., 36th Symposium on Strength of Materials at High Temperatures, Japan Society of Materials Science, pp. 20–24.

Figures

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Effect of strain rate on stress-strain relationship of the four solders at 353K—(a) 10Sn-90Pb, (b) 40Sn-60Pb, (c) 60Sn-40Pb, (d) 62Sn-36Pb-2Ag
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Effect of temperature on stress-strain relationship of the four solders at 0.5%/s—(a) 10Sn-90Pb, (b) 40Sn-60Pb, (c) 60Sn-40Pb, (d) 62Sn-36Pb-2Ag
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Comparison of the tensile strength predicted by Eq. (1) with the experimental results
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Stress-strain relationship of 60Sn-40Pb at five strain rates
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Effect of Sn content on (a) Young’s modulus, (b) yield stress. Solid symbols are for Ag-Sn-Pb.
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Comparison of predicted Young’s modulus and yield stress with those in experiments—(a) Young’s modulus, (b) yield stress
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Flow stress-plastic strain relationships in semi-log diagram at 353 K at 2.0 %/s
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Relationship between a1,b1 and temperature—(a) variation of a1, (b) variation of b1
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Comparison of stress-strain relationship between prediction and experiment for 10Sn-90Pb solder
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Effect of Sn content on α and β—(a) variation of α, (b) variation of β
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Comparison of the predicted stress with that in experiments—(a) 5Sn-95Pb, (b) 10Sn-90Pb, (c) 40Sn-60Pb, (d) 60Sn-40Pb, (e) 63Sn-37Pb
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Comparison of creep strain rate between asymptotic method and static creep test for 5Sn-95Pb solder
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Shape and dimensions of the test specimen
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Specimen setup and extensometry
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Stress-strain relationship of six types of solders at 2.0%/s at 353 K—(a) to fracture, (b) 0–5%

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