0
TECHNICAL PAPERS

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

[+] Author and Article Information
Sheng Liu, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 125(1), 39-43 (Mar 14, 2003) (5 pages) doi:10.1115/1.1525820 History: Received December 03, 2001; Online March 14, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Edward,  S., 1991, “X-Ray Systems Keep Pace with SMT,” Test Meas. World, 11(3), pp. 21–22.
Adams,  T., 1995, “Acoustic Micro Imaging of Flip Chip Interconnects,” III-Vs Review, 8 (5), Oct., pp. 50–52.
Lau,  J. H., and Keely,  C. A., 1989, “Dynamic Characterization of Surface-Mount Component Leads for Solder Joint Inspection,” IEEE Trans Surface-Mount Component Leads for Solder Joint Inspection, 12 (4), Dec., pp. 594–602.
Semmens,  J. E., and Kessler,  L. W., 1997, “Further Investigation Into the Use of Acoustic Micro Imaging for Analyzing Flip Chip Integrity and Failure Modes,” Proc. SPIE, 6th Int. Conf. and Exhibit. on Multichip, Modules, Denver, CO, February 2–4, pp. 165–169.
Liu, S., Erdahl, D., Ume, I. C., and Achari, A., 2000, “A Novel Method and Device for Solder Joint Quality Inspection by Using Laser Ultrasound,” Proc. Electronic Components and Technology Conference, Las Vegas, NV, May.
Scruby, C. B., and Drain, L. E., 1990, Laser Ultrasonics: Techniques and Applications, Adam Hilger, New York, NY.
Sanderson,  T., Ume,  C., and Jarzynski,  J., 1998, “Experimental and Numerical Results for Intensity Modulated Laser Ultrasonic,” J. Acoust. Soc. Am., 104 (4), Oct.
Gorman, D. J., 1982, Free Vibration Analysis of Rectangular Plates, Elsevier North Holland.
Oppenheim, A., and Schafer, R., 1998, Discrete-Time Signal Processing, 2nd Edition, Prentice-Hall, Englewood Cliffs, NJ.

Figures

Grahic Jump Location
Solder joints of flip chip samples
Grahic Jump Location
Scanning pattern of flip chip samples
Grahic Jump Location
Signal recorded by interferometer
Grahic Jump Location
Power spectrum by using FFT
Grahic Jump Location
Theoretical PSD of a vibration signal
Grahic Jump Location
Time domain averaging compared with Bartlett method
Grahic Jump Location
Power spectrum of flip chip samples
Grahic Jump Location
Signals from flip chip samples
Grahic Jump Location
Error ratio of Good Chip 2
Grahic Jump Location
Error ratio of Bad Chip 1

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In