Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

[+] Author and Article Information
Sheng Liu, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 125(1), 39-43 (Mar 14, 2003) (5 pages) doi:10.1115/1.1525820 History: Received December 03, 2001; Online March 14, 2003
Copyright © 2003 by ASME
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Edward,  S., 1991, “X-Ray Systems Keep Pace with SMT,” Test Meas. World, 11(3), pp. 21–22.
Adams,  T., 1995, “Acoustic Micro Imaging of Flip Chip Interconnects,” III-Vs Review, 8 (5), Oct., pp. 50–52.
Lau,  J. H., and Keely,  C. A., 1989, “Dynamic Characterization of Surface-Mount Component Leads for Solder Joint Inspection,” IEEE Trans Surface-Mount Component Leads for Solder Joint Inspection, 12 (4), Dec., pp. 594–602.
Semmens,  J. E., and Kessler,  L. W., 1997, “Further Investigation Into the Use of Acoustic Micro Imaging for Analyzing Flip Chip Integrity and Failure Modes,” Proc. SPIE, 6th Int. Conf. and Exhibit. on Multichip, Modules, Denver, CO, February 2–4, pp. 165–169.
Liu, S., Erdahl, D., Ume, I. C., and Achari, A., 2000, “A Novel Method and Device for Solder Joint Quality Inspection by Using Laser Ultrasound,” Proc. Electronic Components and Technology Conference, Las Vegas, NV, May.
Scruby, C. B., and Drain, L. E., 1990, Laser Ultrasonics: Techniques and Applications, Adam Hilger, New York, NY.
Sanderson,  T., Ume,  C., and Jarzynski,  J., 1998, “Experimental and Numerical Results for Intensity Modulated Laser Ultrasonic,” J. Acoust. Soc. Am., 104 (4), Oct.
Gorman, D. J., 1982, Free Vibration Analysis of Rectangular Plates, Elsevier North Holland.
Oppenheim, A., and Schafer, R., 1998, Discrete-Time Signal Processing, 2nd Edition, Prentice-Hall, Englewood Cliffs, NJ.


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Solder joints of flip chip samples
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Scanning pattern of flip chip samples
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Signal recorded by interferometer
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Power spectrum by using FFT
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Theoretical PSD of a vibration signal
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Time domain averaging compared with Bartlett method
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Power spectrum of flip chip samples
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Signals from flip chip samples
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Error ratio of Good Chip 2
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Error ratio of Bad Chip 1




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