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TECHNICAL PAPERS

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

[+] Author and Article Information
Sheng Liu, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 125(1), 39-43 (Mar 14, 2003) (5 pages) doi:10.1115/1.1525820 History: Received December 03, 2001; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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Solder joints of flip chip samples
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Scanning pattern of flip chip samples
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Signal recorded by interferometer
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Power spectrum by using FFT
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Theoretical PSD of a vibration signal
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Time domain averaging compared with Bartlett method
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Power spectrum of flip chip samples
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Signals from flip chip samples
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Error ratio of Good Chip 2
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Error ratio of Bad Chip 1

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