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TECHNICAL PAPERS

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

[+] Author and Article Information
Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki

Department of Chemical Engineering, Graduate School of Engineering, Kyushu University, Fukuoka, 812-8581 Japan

Nobutaka Ito, Mami Nagatake, Mitsuru Sato

Fujitsu Limited, Kawasaki, 211-8588 Japan

J. Electron. Packag 125(1), 31-38 (Mar 14, 2003) (8 pages) doi:10.1115/1.1525244 History: Received April 21, 2001; Revised January 04, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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Common failure sites in an electronic device
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Coordinate system around a corner of jointed dissimilar materials
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V-notched threepoint bending specimen
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100-pin quadrangle flat package (QFP 100-pin)
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Boundary condition of the 2-D model of QFP
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Stress intensity factors of the corners in sections A and B obtained by the contact and noncontact 2-D analyses
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3-D symmetrical quarter-model of the QFP
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Stress intensity factor of V-notch corner per unit vapor pressure along the short and long corner fronts
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Short and long corner fronts in a lower portion of the molding resin
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The weight of absorbed moisture
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2-D moisture absorption model for the QFP
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Distribution of the moisture concentration under the die pad (85°C temperature and 85% humidity atmosphere)
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The relationship between the absorption time and the moisture concentration
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Estimated vapor pressure for some assumed temperatures under the die pad
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Weight of absorbed water with absorption time and observation of the QFP after solder reflow process

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