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TECHNICAL PAPERS

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

[+] Author and Article Information
Timothy Ferguson, Jianmin Qu

Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 125(1), 24-30 (Mar 14, 2003) (7 pages) doi:10.1115/1.1524132 History: Received January 30, 2002; Online March 14, 2003
Copyright © 2003 by ASME
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References

Soles,  C., and Yee,  A., 2000, “A Discussion of the Molecular Mechanisms of Moisture Transport in Epoxy Resins,” J. Polym. Sci., Part B: Polymer Physics, 38, pp. 792–802.
Soles,  C., Chang,  T., Gidley,  D., and Yee,  A., 2000, “Contributions of the Nanovoid Structure to the Kinetics of Moisture Transport in Epoxy Resins,” J. Polym. Sci., Part B: Polymer Physics, 38, pp. 776–791.
Ferguson,  T., and Qu,  J., 2001, “Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface,” ASME J. Electron. Packag. 124, pp. 106–110.
Crank, J., 1956, The Mathematics of Diffusion, Clarendon Press, Oxford, UK.
Shi, S., 2000, “Study on No-Flow Underfill Materials for Low-Cost Flip-Chip Applications,” doctoral thesis, Georgia Institute of Technology, School of Materials Science Engineering, Atlanta, GA.
Wong, C. P., Shi, S., and Jefferson, G., 1997, “High Performance No-Flow Underfills for Low-Cost Flip-Chip Applications,” IEEE Electronic Components and Technology Conference, pp. 850–858.
Vanlandingham,  M., Eduljee,  R. F., and Gillespie,  J. W., 1999, “Moisture Diffusion in Epoxy Systems,” J. Appl. Polym. Sci., 71, pp. 787–798.
Shen,  C. H., and Springer,  G. S., 1976, “Moisture Absorption and Desorption of Composite Materials,” J. Compos. Mater., 10, pp. 2–10.
Wong, E. H., Chan, K. C., Lim, T. B., and Lam, T. F., 1999, “Non-Fickian Moisture Properties Characterization and Diffusion Modeling for Electronic Packages,” Proc. 49th IEEE ECTC, pp. 302–306.

Figures

Grahic Jump Location
Percent weight gain of UR-A diffusion coefficient test specimens at 85°C/85%RH
Grahic Jump Location
Percent weight gain of UR-B diffusion coefficient test specimens at 85°C/85%RH
Grahic Jump Location
Diffusion coefficient determination and Fickian curve fit at 85°C/85%RH for UR-A
Grahic Jump Location
Diffusion coefficient determination and Fickian curve fit at 85°C/85%RH for UR-B
Grahic Jump Location
Interfacial fracture test specimen
Grahic Jump Location
Moisture concentration distribution for 2.210-mm-thick UR-A interfacial fracture test specimen at 85°C/85%RH after 1, 5, and 10 h of exposure
Grahic Jump Location
Moisture concentration distribution for 2.155-mm-thick UR-B interfacial fracture test specimen at 85°C/85%RH after 1, 5, and 10 h of exposure

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