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TECHNICAL PAPERS

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

[+] Author and Article Information
Mehrdad N. Ghasemi Nejhad, Chiling Pan, Hongwei Feng

Department of Mechanical Engineering, University of Hawaii at Manoa, Honolulu, HI 96822

J. Electron. Packag 125(1), 4-17 (Mar 14, 2003) (14 pages) doi:10.1115/1.1512295 History: Received September 01, 2000; Online March 14, 2003
Copyright © 2003 by ASME
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References

Figures

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Schematic model of the film/substrate system used in the analytical solution, showing the substrate to be divided into ns layers and the film in nf layers, where ns+nf=30, in the developed software
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Flow chart for computing equivalent reference temperature (ERT)
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Schematic of processing steps used in the software algorithm to calculate residual stresses using the ERT model
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Flow chart for residual stress analysis using the ERT model
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Two-layer model for 2-D FEA
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Two-layer model for 3-D FEA
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Three-layer model for 2-D FEA
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Three-layer model for 3-D FEA
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ANSYS finite element analysis output for residual stress analysis (3-D model)
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Schematic of an advanced bulge test system 44

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