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ADDITIONAL TECHNICAL PAPERS

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

[+] Author and Article Information
J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan

Agilent Technologies, Inc., Santa Clara, CA 95052

J. Electron. Packag 124(4), 403-410 (Dec 12, 2002) (8 pages) doi:10.1115/1.1512294 History: Revised August 06, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Fully assembled (fiber-attached) 32×32 all-optical device
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Solder sealing ring on the silicon chip
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Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate
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Finite element model for one-quarter of the photonic package
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Creep strain rate versus stress of 48Sn-52In solder
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Temperature cycling condition
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Creep hysteresis loops (shear stress versus shear creep strain)
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Time-history deflection of the silica and silicon chip at the package center
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Time-history stress in the solder sealing ring
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Time-history creep strain in the solder sealing ring
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Time-history creep strain energy density in the solder sealing ring
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C-Mode SAM of the solder sealing ring
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Capacitance gage calibration curve
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Isothermal fatigue test load drop curves
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Isothermal fatigue test hysteresis loops
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Isothermal fatigue test results
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Bolt configuration and surrounding materials
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Bolt finite element model
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Finite element model of the package with the bolt
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Deformation of the bolt under pretension
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Time-history deflection of the Mo substrate and Al plate at the package center
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Time-history deflection of the Mo substrate and Al plate with smaller time steps
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The time-history stick and slide friction status

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