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ADDITIONAL TECHNICAL PAPERS

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

[+] Author and Article Information
J. Lau, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan

Agilent Technologies, Inc., Santa Clara, CA 95052

J. Electron. Packag 124(4), 403-410 (Dec 12, 2002) (8 pages) doi:10.1115/1.1512294 History: Revised August 06, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Fouquet, J. E., Venkatesh, S., Troll, M., Chen, D., Wong, H. F., and Barth, P. W., 1998, “A Compact Scalable Cross-Connect Switch Using Total Internal Reflection and Thermally Generated Bubbles,” Proc., IEEE/Lasers and Electro Optics Society Annual Meeting, Vol. 2, pp. 169–170.
Fouquet, J. E., 2000, “Compact Optical Cross-Connect Switch Based on Total Internal Reflection in a Fluid-Containing Planar Lightwave Circuit,” Proc., Optical Fiber Communication Conference, Technical Digest, Vol. 1, pp. 204–206.
Venkatesh, S., Son, J., Fouquet, J., Haven, R., Schroeder, D., Guo, H., Wang, W., Russell, P., Chow, A., and Hoffmann, P., 2002, “Recent Advances in Bubble-Actuated Photonic Cross-Connect Switches,” Proc., SPIE Photonics West, pp. 27–35.
Venkatesh, S., DePue, M., Okano, H., and Uetsuka, H., 2002, “Insertion Loss Reduction by Optimization of Waveguide Perturbations,” Proc., Optical Fiber Communication Conference, Postdeadline Papers, pp. FA4-1-FA4-3.
Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
Lau, J. H., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, NY.
Lau, J. H., and Lee, R., 2001, Microvias for Low Cost High Density Interconnects, McGraw-Hill, New York, NY, pp. 456–457.
Lau, J. H., Wong, C. P., Prince, J. L., and Nakayama, W., 1998, Electronic Packaging: Design, Materials, Process, and Reliability, McGraw-Hill, New York, NY.
ANSYS Users’ Manual, 2002.
Mei,  Z. and Morris,  J., 1992, “Superplastic Creep of Low Melting Point Solder Joints,” J. Electron. Mater., 21(4), pp. 401–407.
Lau, J. H., 1991, Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York, NY, pp. 225–265.
Lau, J., Mei, Z., Pang, S., Amsden, C., Rayner, J., and Pan, S., 2002, “Nonlinear Time and Temperature Dependent Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch,” Proc. Photonic Devices and Systems Packaging Symposium, July, pp. 95–106.
Baumeister, T., Avallone, E., and Baumeister III, T., Marks’ Handbook for Mechanical Engineers, McGraw-Hill, New York, NY, pp. 3–30.

Figures

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Fully assembled (fiber-attached) 32×32 all-optical device
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Solder sealing ring on the silicon chip
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Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate
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Finite element model for one-quarter of the photonic package
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Creep strain rate versus stress of 48Sn-52In solder
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Temperature cycling condition
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Creep hysteresis loops (shear stress versus shear creep strain)
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Time-history deflection of the silica and silicon chip at the package center
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Time-history stress in the solder sealing ring
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Time-history creep strain in the solder sealing ring
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Time-history creep strain energy density in the solder sealing ring
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C-Mode SAM of the solder sealing ring
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Capacitance gage calibration curve
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Isothermal fatigue test load drop curves
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Isothermal fatigue test hysteresis loops
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Isothermal fatigue test results
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Bolt configuration and surrounding materials
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Bolt finite element model
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Finite element model of the package with the bolt
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Deformation of the bolt under pretension
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Time-history deflection of the Mo substrate and Al plate at the package center
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Time-history deflection of the Mo substrate and Al plate with smaller time steps
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The time-history stick and slide friction status

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