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ADDITIONAL TECHNICAL PAPERS

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

[+] Author and Article Information
C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu

Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong

J. Electron. Packag 124(4), 397-402 (Dec 12, 2002) (6 pages) doi:10.1115/1.1510865 History: Received October 15, 2000; Revised October 18, 2001; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Time resolved temperature during reflow between the chip and the PCB
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Cross section of a reflowed solder joint
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SEM micrographs of etched solder joints showing the Cu-Sn IMC layer under (a) Qn=871 s°C, (b) Qn=1441 s°C, (c) Qn=2617 s°C, and (d) Qn=4160 s°C
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SEM micrographs of etched solder joints showing the Ni-Sn IMC layer under (a) Qn=871 s°C, (b) Qn=1441 s°C, (c) Qn=2617 s°C, and (d) Qn=4160 s°C
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Mean Cu-Sn/Ni-Sn IMC thickness against heating factor
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(a) A schematic diagram of the shear test configuration for the Ni3Sn4 IMC layer at the interface of solder/substrate pad; (b) a schematic diagram of the shear test configuration for the Cu6Sn5 IMC layer at the interface of solder/substrate pad
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The plot of shear strength against heating factor (Cu-Sn IMC)
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The plot of shear strength against heating factor (Ni-Sn IMC)
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DSC measurement of the underfill reflowed using the six different reflow profiles

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