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ADDITIONAL TECHNICAL PAPERS

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

[+] Author and Article Information
C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu

Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong

J. Electron. Packag 124(4), 397-402 (Dec 12, 2002) (6 pages) doi:10.1115/1.1510865 History: Received October 15, 2000; Revised October 18, 2001; Online December 12, 2002
Copyright © 2002 by ASME
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References

Vardaman, E. J., and Goodman, T., 1997, “Flip Chip Market Trends and Infrastructure Limitations,” IEMT/IMC Proc., p. 37.
de Langen, M. T. W., 1997, “Low cost Flip Chip Technology,” IEMT/IMC Proc., p. 67.
Wong, C. P., Shi, S. H., and Jefferson, G., 1997, “High Performance No-Flow Underfills for Low Cost Flip Chip Applications,” Electronic Components and Technology Conference, pp. 850–858.
Pascarella, N. W., and Baldwin, D. F., “Advanced Encapsulation Processing for Low Cost Electronics Assembly—A Cost Analysis,” Advances in Electronic Packaging, Vol. 1, pp. 359–363, 1997.
Tu, P. L., Tang, C. W., Chan, Y. C., Hung, K. C., and Lai, J. K. L., 1999, “Effect of Ni/Sn Intermetallic on the fatigue lifetime of μBGA Solder Joints,” Proc. First Int. Workshop on Electronics Materials and Packaging, Singapore.
Tu,  P. L., Chan,  Y. C., and Lai,  J. K. L., 1997, “Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 20(1), p. 87.
Tang, C. W., Chan, Y. C., Hung, K. C., and Webb, D. P., 1999, “Non-Destructive Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM,” submitted to IEEE Trans. CPMT-Part B.
Tu, P. L., Chan, Y. C., Hung, K. C., and Lai, J. K. L., 1999, “Comparative Study of MicroBGA Reliability under Bending Stress,” submitted to IEEE trans. CPMT Part B, 20.
Liu,  A. A., Kim,  H. K., Tu,  K. N., and Totta,  P. A., 1996, J. Appl. Phys., 80, 2774.
Liu, C. Y., Chen, Chih, Mal, A. K., and Tu, K. N., “Direct correlation between mechanical failure and metallurgical in flip chip solder joints,” J. Appl. Phys., 85 , (7).
Hung, K. C., Chan, Y. C., and Tang, C. W., “Metallurgical Reaction and Mechanical Strength of Electroless Ni-P Solder Joints for Advanced Packaging Applications,” accepted for publication in J. Materials Science: Materials in Electronics.
Lau, J. H., “Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies.”

Figures

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Time resolved temperature during reflow between the chip and the PCB
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Cross section of a reflowed solder joint
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SEM micrographs of etched solder joints showing the Cu-Sn IMC layer under (a) Qn=871 s°C, (b) Qn=1441 s°C, (c) Qn=2617 s°C, and (d) Qn=4160 s°C
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SEM micrographs of etched solder joints showing the Ni-Sn IMC layer under (a) Qn=871 s°C, (b) Qn=1441 s°C, (c) Qn=2617 s°C, and (d) Qn=4160 s°C
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Mean Cu-Sn/Ni-Sn IMC thickness against heating factor
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(a) A schematic diagram of the shear test configuration for the Ni3Sn4 IMC layer at the interface of solder/substrate pad; (b) a schematic diagram of the shear test configuration for the Cu6Sn5 IMC layer at the interface of solder/substrate pad
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The plot of shear strength against heating factor (Cu-Sn IMC)
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The plot of shear strength against heating factor (Ni-Sn IMC)
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DSC measurement of the underfill reflowed using the six different reflow profiles

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