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ADDITIONAL TECHNICAL PAPERS

An Analytical Cure Model for Underfill Epoxies

[+] Author and Article Information
R. L. Mahajan, C. P. Malhotra, R. K. Sharma

Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309-0427

J. Electron. Packag 124(4), 391-396 (Dec 12, 2002) (6 pages) doi:10.1115/1.1510864 History: Received April 01, 2001; Revised April 20, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Isothermal cure curves for Hysol FP4511
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Plot of isothermal values of −ln(1−α) versus time t (for first order reaction kinetics)
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Plot of isothermal values of 1/(1−α)−1 versus time t (for second order reaction kinetics)
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Schematic of FCOB sample
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Plot of temperature versus time for the part from finite element analysis and from Eq. (10)
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Cure versus time curves for a typical PCB with an FCOB sample for different values of h(Ti=25°C,T=165°C)
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Time to reach 99% cure versus h(T=165°C). Numerical values and fit to Eq. (18).
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Heat transfer coefficient as coupon is heated from room temperature to the temperature of the heating fluid
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Sketch showing dimensions of the copper coupon and sample pan
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Typical Reaction Exotherm of Hysol FP4511
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Comparison between analytical and experimental values of cure versus time for liquid immersion and hot-air oven heating

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