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ADDITIONAL TECHNICAL PAPERS

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

[+] Author and Article Information
Ki-Ju Kang, Seon-Ho Choi

Department of Mechanical Engineering, Chonnam National University, Kwangju 500-757, Republic of Korea

Tae-Sung Bae

Department of Dental Materials and Institute of Oral Bioscience, Chonbuk National University, Chonju 561-756, Republic of Korea

J. Electron. Packag 124(4), 385-390 (Dec 12, 2002) (6 pages) doi:10.1115/1.1510863 History: Received October 12, 2001; Online December 12, 2002
Copyright © 2002 by ASME
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References

Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold, New York, NY.
Frear, D. R., Burchett, S. N., and Morgan, H. S., 1994, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, NY.
McKeown, S. A., 1993, “Solder Life Prediction of Leadless and Leaded Surface Mount Components Under Thermal Cycling and Vibration,” Adv. Electronic Packaging, EEP-Vol. 4-2, pp. 987–994.
Sidharth,  and Baker,  D. B., 1996, “Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components,” ASME J. Electron. Packag., 118, pp. 244–249.
Logsdon,  W. A., Liaw,  P. K., and Burke,  M. A., 1990, “Fracture Behavior of 63Sn-37Pb Solder,” Eng. Fract. Mech., 36, pp. 183–218.
Cutiongco,  E. C., Vaynman,  S., Fine,  M. E., and Jeannotte,  D. A., 1990, “Isothermal Fatigue of 63Sn-37Pb Solder,” ASME J. Electron. Packag., 112, pp. 110–114.
Guo,  Z., and Conrad,  H., 1993, “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints,” ASME J. Electron. Packag., 115, pp. 159–164.
Choi,  S. H., Song,  B. G., Kang,  K. J., and Fleck,  N. A., 2001, “Fracture of a Ductile Layer Constrained by Stiff Substrates,” Fatigue Fract. Eng. Mater. Struct., 23, pp. 1–13.
Song,  J. H., Shin,  Y. S., and Im,  Y. S., 1989, “Construction of Small Sized, Electro-Dynamic Type Bending Fatigue Testing Machine,” in Korean KSME Trans. A, 13(1), pp. 199–203.
Hutchinson,  J. W., and Suo,  Z., 1991, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 28, pp. 1–21.
ABAQUS, 1996, User’s Manual, Version 5.6, HKS Inc.
Lampe,  B. T., 1976, “Room Temperature Aging Properties of Some Solder Alloys,” Welding Research Supplement, p. 330-s–340-s.
Morris, J. W., Jr., Goldstein, J. L. F., and Mei, Z., 1994, “Microstructual Influences on the mechanical properties of solder,” The Mechanics of Solder Alloy Interconnects, eds., D. R. Frear, S. N. Burchett, and H. S. Morgan, Van Nostrand Reinhold, pp. 7–41.
Yao,  D., and Shang,  J. K., 1995, “Effect of Aging on Fatigue Crack Growth at Sn-Pb/Cu Interfaces,” Metall. Mater. Trans. A, 26A, pp. 2677–2685.
Miller,  K. J., 1991, “Metal Fatigue—Past, Current and Future,” I Mech E Conf. Publ., 205, pp. 1–14.

Figures

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Configurations of single-lap-joint specimen
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Schematic diagram of the fatigue test system
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Finite element model of the single-lap-joint specimen
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Variation of mode mix with the crack length under constant load control
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Variation of J-integral with the crack length under constant load control
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Microstructures of the solder in the specimens of (a) series A: air cooled and aged at 150°C/200 h, (b) series B: furnace cooled and aged at room temperature; and (c) series C: furnace cooled and aged at 150°C/200 h  
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Scanning electron micrographs of microstructure near the interface
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Scanning electron micrographs of fatigue crack growth from the pre-crack tip—(a) a general view; (b) and (c) magnified views of the strange rough surface developed on the lateral surface at the initial stage of crack growth
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The main crack path and some micro-cracks developed nearby
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Cracks propagated along the colony boundaries
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A schematic diagram of the three stages of crack propagation near the interface of solder joints
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Experimental results of the fatigue crack growth rate versus ΔJ

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