Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

[+] Author and Article Information
Ki-Ju Kang, Seon-Ho Choi

Department of Mechanical Engineering, Chonnam National University, Kwangju 500-757, Republic of Korea

Tae-Sung Bae

Department of Dental Materials and Institute of Oral Bioscience, Chonbuk National University, Chonju 561-756, Republic of Korea

J. Electron. Packag 124(4), 385-390 (Dec 12, 2002) (6 pages) doi:10.1115/1.1510863 History: Received October 12, 2001; Online December 12, 2002
Copyright © 2002 by ASME
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Configurations of single-lap-joint specimen
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Schematic diagram of the fatigue test system
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Finite element model of the single-lap-joint specimen
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Variation of mode mix with the crack length under constant load control
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Variation of J-integral with the crack length under constant load control
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Microstructures of the solder in the specimens of (a) series A: air cooled and aged at 150°C/200 h, (b) series B: furnace cooled and aged at room temperature; and (c) series C: furnace cooled and aged at 150°C/200 h  
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Scanning electron micrographs of microstructure near the interface
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Scanning electron micrographs of fatigue crack growth from the pre-crack tip—(a) a general view; (b) and (c) magnified views of the strange rough surface developed on the lateral surface at the initial stage of crack growth
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The main crack path and some micro-cracks developed nearby
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Cracks propagated along the colony boundaries
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A schematic diagram of the three stages of crack propagation near the interface of solder joints
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Experimental results of the fatigue crack growth rate versus ΔJ




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