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TECHNICAL PAPERS

Impact Resistance of SM Joints Formed With ICA

[+] Author and Article Information
C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

Department of Physics and Materials Science, City University of Hong Kong, Hong Kong

J. Electron. Packag 124(4), 374-378 (Dec 12, 2002) (5 pages) doi:10.1115/1.1502666 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Schematic diagram of split Hopkinson bar
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Schematic diagram of three-point bending
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Schematic diagram of set up of three-point bend test within a split Hopkinson bar
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Variation of strain rate with time
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Schematic diagram of shear test
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Voids in the fillet of the ICA joint
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Voids found in the ICA between resistor and PCB
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Cross-section of the ICA joint
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Shear strength of the ICA
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Position of crack in the SM ICA joint
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Interface crack between resistor and ICA

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