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TECHNICAL PAPERS

Electrically Conductive Adhesive Formulations for SMT Applications

[+] Author and Article Information
Ryszard Kisiel

Warsaw University of Technology, Institute of Microelectronics and Optoelectronics, ul. Koszykowa 75 00-662, Warszawa, Polande-mail: Kisiel@imio.pw.edu.pl

J. Electron. Packag 124(4), 367-370 (Dec 12, 2002) (4 pages) doi:10.1115/1.1497628 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Wong, C. P., and Daoqiang Lu, 2000, “Recent Advances on Electrically Conductive Adhesives for Electronics Applications,” Proc. of 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland 18–21 June, p. 121.
Rosenberd, Halle, 1992, “Electrically Conductive Adhesives for SMT,” Elektronik Centralen, Denmark, Aug.
Kisiel, R., 2000, “The Influence of Adhesive Composition on Mechanical and Electrical Properties of Joints between SMDs and PCBs,” Proc. of 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18–21, p. 240.
Kisiel, R., and Mościcki, A., 2000, “Electrically conductive adhesives in SMT–the influence of adhesive composition on mechanical and electrical properties,” Proc. of XXIV IMAPS Conference, Rytro, Poland, September 25–28, p. 199.
Ross, P. J., 1988, “Taguchi Techniques for Quality Engineering,” McGraw-Hill, New York,
Kisiel, R., 1998, “Resistivity of Lead-free Solder Joints,” Proc. of 21st International Spring Seminar on Electronics Technology, Neusiedl am SEE, Austria, May 4–7, p. 32.
Daoqiang Lu, and Wong, C. P., 2000, “Development of Solder Replacement Conductive Adhesives with Stable Resistance and Superior Impact Performance” Proc. of 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, June 18–21, p. 110.
Friedel, K., Kisiel, R., and Lozinski, W., 1997, ”A study of wetting Performance of Lead-free Solders,” Proc. of 20th International Spring Seminar on Electronics Technology, Szklarska Poreba, Poland, June 8–11, p. 13.

Figures

Grahic Jump Location
The influence of adhesive type resin on joint resistance
Grahic Jump Location
The influence of adhesive resin type on tear off force
Grahic Jump Location
The influence of adhesive resin type on shearing force

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