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TECHNICAL PAPERS

Electrically Conductive Adhesive Formulations for SMT Applications

[+] Author and Article Information
Ryszard Kisiel

Warsaw University of Technology, Institute of Microelectronics and Optoelectronics, ul. Koszykowa 75 00-662, Warszawa, Polande-mail: Kisiel@imio.pw.edu.pl

J. Electron. Packag 124(4), 367-370 (Dec 12, 2002) (4 pages) doi:10.1115/1.1497628 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

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Grahic Jump Location
The influence of adhesive type resin on joint resistance
Grahic Jump Location
The influence of adhesive resin type on tear off force
Grahic Jump Location
The influence of adhesive resin type on shearing force

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