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TECHNICAL PAPERS

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

[+] Author and Article Information
D. Vogel, B. Michel

Fraunhofer Institute IZM, Department Mechanical Reliability and Micromaterials, D-13355 Berlin, Germany

R. Kühnert

Image Instruments GmbH, D-09125 Chemnitz, Germany

M. Dost

CWM Chemnitzer Werkstoffmechanik GmbH, D-09117 Chemnitz, Germany

J. Electron. Packag 124(4), 345-351 (Dec 12, 2002) (7 pages) doi:10.1115/1.1506698 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Ogawa, H., et al., 1997, “Stress Strain Diagrams of Microfabricated Thin Films,” Proc. of Micro Materials ’97, April 16–18, Berlin, Germany, pp. 716–719.
Willecke, R., and Ho, P. S., 1997, “Study of Vertical Thermo-Mechanical Properties of Polyimide Thin Films,” Proc. of Micro Materials ’97, April 16–18, Berlin, pp. 721–724.
Vogel, D., et al., 1997, “Deformation Analysis on Flip Chip Solder Interconnects by MicroDAC,” Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, February 9–13, Orlando, FL, TMS Pub. Cat. No. 96-80433, pp. 429–443.
Vogel,  D., Schubert,  A., Faust,  W., Dudek,  R., and Michel,  B., 1996, “MicroDAC—A Novel Approach to Measure In Situ Deformation Fields of Microscopic Scale,” Microelectron. Reliab., 36(11/12), pp. 1339–1342.
Vogel, D., Luczak, F., Wittler, O., Gollhardt, A., Walter, H., and Michel, B., 2000, “Measurement of Material Properties by a Modified MicroDAC Approach,” Proc. of Micro Materials 2000, Berlin Germany.
Wittler, O., Sprafke, P., Walter, H., Gollhardt, A., Vogel, D., and Michel, B., 2000, “Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications,” Materials Week 2000, September 25–28, Munich, Germany.
Vogel, D., Kühnert, R., and Michel, B., 1999, “Strain Measurement in Micrometrology,” Int. Symp. on Photonics and Applications at the ISPA ’99, Singapore, Proc. of SPIE, Vol. 3897, pp. 224–238.
Lu,  Y. G., Zhong,  Z. W., Yu,  J., Xie,  H. M., Ngoi,  B. K. A., Chai,  G. B., and Asundi,  A., 2001, “Thermal deformation measurement of electronic packages using the atomic force microscope scanning moire technique,” Rev. Sci. Instrum., 72, No. 4, pp. 2180–2185.
Wiese, S., Rossek, U., Feustel, F., and Meusel, E., 1997, “Image Processing Analysis in Micropackaging,” Proc. of “Micro Materials ’97,” April 16–18, Berlin, Germany, pp. 237–240.
Lu,  H.: 1998, “Application of digital speckle correlation to microscopic strain measurement and material’s property characterization,” ASME J. Electron. Packag., 120 September, pp. 275–279.
Anwander, M., Weiss, B., Zagar, Z., and Weiss, H., 1996, A laser speckle correlation method for strain measurements at elevated temperatures, Proc. the Symp. “Local Strain and Temperature Measurements in Non-Uniform Fields at Elevated Temperatures,” March 14–15, Berlin, Germany, pp. 49–58.
German patent 10023752.5-52
Vogel, D. and Michel, B., 2001, “Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement,” Proc. of “IEEE-NANO 2001,” October 28–30, Maui, HI, pp. 309–312.

Figures

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Principle of displacement field measurement by the comparison of load state images, white arrow: displacement vectors in the regular grid of measurement points
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Deformation field (visualized by deformed virtual object grids) extracted from images of a CTE specimen by the developed mtest software, temperature difference between the two treated images: 125 K; left side: deformation field after correlation analysis without eliminating casual error points, right side: deformation field after correlation analysis and elimination of casual error points (original white undeformed and black deformed mesh, deformed black mesh after automatic elimination of error data points in the measurement mesh)
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Scheme of an optical CTE measurement system
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Average strain versus temperature curves obtained for accuracy check
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Poisson ratio measurement from a modified microDAC algorithm, computation of Poisson ratio from the incline of the two strain curves versus load time–standard dog bone specimen
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CTE measurement from a modified microDAC algorithm—(a) typical strain versus temperature for a filled epoxy material (two perpendicular strain components); (b) dependency of CTE values on specimen thickness
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Thermal expansion of an underfill material with filler settling (low filler content at top, high filler content at bottom), CTEmicroDAC values determined at the separated underfill foil (surface measurements), CTETMA for the same specimen: 34.6 ppm K-1
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CTE measurement on a packaging material (thermoplastics) by mtest (program code developed by Image Instruments for CTE evaluation), measurement has been carried out on the top of a piece of the cylinder, measurement area ≈400×1500 μm, anisotropic CTE in radial (z) and tangential (x) directions
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Measurement of crack tip position by correlation analysis, comparing two subsequent load state images 12–(a) displacement component in the direction perpendicular to the crack boundary, measured above and below the crack line, furthermore sum of both displacements above and below the crack line representing the specimen rotation during testing; (b) found crack tip on the CT specimen by a numerical crack position algorithm (based on the displacement values on both sides of the crack boundary as determined in Fig. 9(a))
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nanoDAC displacement measurement from AFM images nearby a crack tip on an epoxy specimen—(a) AFM topography scan (30 μm×30 μm image size, height scale: 0.22 μm/div) after crack opening with line scan; (b) displacement field ux (component perpendicular to the crack boundaries)

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