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TECHNICAL PAPERS

Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

[+] Author and Article Information
C. L. Chung

I-Shou University, Department of Materials Science and Engineering, 1, Section 1, Shiuecheng Rd., Dashu Shiang, Kaohsiung, Taiwan, R.O.C.e-mail: markchun@isu.edu.tw

James Fan, M. L. Huang, F. J. Tsai

ChipMOS Technologies Inc. No. 5, Nan-Ko Rd. 7, Science-Based Industrial Park, Tainan, Taiwan, R.O.C.e-mail: mark_chung@chipmos.com.tw

J. Electron. Packag 124(4), 334-339 (Dec 12, 2002) (6 pages) doi:10.1115/1.1498265 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Detailed structure and cross section of CSP package
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The tracking records of the DAM-A on moisture uptake up to 7 days under PCT conditions
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The tracking records of the die shear test up to 7 days under PCT conditions
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The die shear test fracture surface of (a) fresh sample, (b) socked in PCT 1 day, and (c) socked in PCT 2 days. Fracture surface is sticky and muddy more like DAM-A raw material status. The die shear test, die size is 3.393×1.939 mm2 .
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After die shear test, the fracture surfaces of (a) fresh sample (PCT 0 day) on substrate side, x400, (b) PCT 7 days sample on substrate side, x450, (c) fresh sample on die backside, x3000, and (d) PCT 7 days sample on die backside, x3000
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The tracking records of SAT through scans up to 7 days under PCT conditions (121°C, 100 RH% and 2 atm). The compound is an S compound system.
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SAT through scans and relative cross-section of (a) fresh sample, (b) after socked in PCT 7 days and SAT through scans exhibit pass sample, and (c) after socked in PCT 7 day and SAT through scans exhibit fail sample. The compound is an S compound system.
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(a) Cross-section of SAT fail sample after PCT7 days induce a 20∼40 μm micro-gap between die backside and DAM-A and (b) peeling off surfaces on the delaminating interface. The die backside is very clean without any DAM-A residual. The compound is an S compound system.
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DMA analysis of DAM-A (a) fresh sample exhibits single peak, (b) after PCT 1 day sample exhibits double peaks, and (c) after PCT 2 day sample exhibits single peak
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After PCT 7 days; (a) the DAM-A is eroded on the interface between die backside and substrate, (b) the low molecule weight materials in DAM-A are leaked out
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The tracking record of different mold compound systems on moisture uptake up to 7 days in PCT conditions
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SAT through scan result of three kind of compound system after PCT 7 days. (a) H compound system, (b) S compound system, and (c) P compound system
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The PCT failure mode illustration. (a) Fresh sample at room temperature; (b) PCT initial state, warpage induced due to the difference of thermal expansion coefficient; (c) compound, substrate and DAM-A swell, and then the interface between die back-side and DAM-A de-bond; (d) gap formed and constrained on the compound-substrate interface; (e) gap propagated along compound and substrate interface.

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