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TECHNICAL PAPERS

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

[+] Author and Article Information
Noriyasu Kawamura, Takashi Kawakami

Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan

Kikuo Kishimoto, Masaki Omiya

Department of Mechanical and Intelligent Systems Engineering, Tokyo Institute of Technology, Tokyo, Japan

Toshikazu Shibuya

Department of Production Systems Engineering, Oita University, Oita, Japan

J. Electron. Packag 124(4), 323-327 (Dec 12, 2002) (5 pages) doi:10.1115/1.1501304 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Fukuzawa, I., et al., 1985, “Moisture Resistance Degradation of Plastic LSI’s by Reflow Soldering,” Proc. 23rd IRPS, pp. 192–197.
Kitano, M., Nishimura, A., Kawai, S., and Nishi, K., 1988, “Analysis of Package Cracking During Reflow Soldering Process,” Proc 26th IRPS, pp. 90–95.
S. Ohizumi, S., et al., 1990, “Analytical and Experimental Study for Designing Molding Compounds for Surface Molding Devices,” Proc 40th ECTC, pp. 632–640.
Kawamura, N., Kawakami, T., Matumoto, K., Sawada, K., and Taguchi, H., 1993, “Structural Integrity Evaluation for a Plastic Package during Soldering Process,” Advances in Electronic Packaging ASME, EEP-Vol. 4–1, pp. 91–95.
Sawada, K., Nakazawa, T., Kawamura, N., and Sudo, T., 1993, “Package Deformation and Cracking Mechanism Due to Reflow Soldering,” Proc. Japan IEMT, pp. 295–298.
Sawada, K., Nakazawa, T., Kawamura, N., Matsumoto, K., Hiruta, Y., and Sudo, T., 1994, “Simplified and Practical Estimation of Package Cracking During Reflow Soldering Process,” Proc. 32nd IRPS, pp. 114–119.
Mino, T., Sawada, K., Kurosu, A., Otsuka, M., Kawamura, N., and Yoo, H., Y., 1998, “Development of Moisture-proof Thin and Large QFP with Copper Lead Frame,” Proc. 48th ECTC, pp. 1125.
Kawamura, N., Hirohata, K., Kawakami, T., Sawada, K., Mino, T., Kurosu, A., Takano, E., and Yoo, H., Y., 1998, “Adhesion Integrity Evaluation of Plastic Encapsulated Semiconductor Package,” Proc. 48th ECTC, pp. 1132.
Ikeda, T., Arase, I., Ueno, Y., Miyazaki, N., Ito, N., Nagatake, M., and Sato, M., 1999, “Strength Evaluation of Plastic Packages during Soldering Reflow Process Using Stress Intensity Factors of V-notch,” Advances in Electronic Packaging ASME, EEP-Vol. 26-2, pp. 1741–1748.

Figures

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Plastic encapsulated package
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Cross section of cracked package
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Notch bending specimen geometry and loading configuration
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Load-displacement curve
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Relationship between nominal stress and radius of notch tip
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Analyzed model geometry and loading configuration
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Finite-element models of specimen
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Stress distribution in specimen. (a) σx and (b) σy
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Stress distribution around notch tip and fracture criterion (Resin A). (a) Room temperature and (b) 250°C.
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Stress distribution around notch tip and fracture criterion (Resin B). (a) Room temperature and (b) 250°C.

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