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TECHNICAL PAPERS

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

[+] Author and Article Information
Noriyasu Kawamura, Takashi Kawakami

Corporate Research and Development Center, Toshiba Corporation, Kawasaki, Japan

Kikuo Kishimoto, Masaki Omiya

Department of Mechanical and Intelligent Systems Engineering, Tokyo Institute of Technology, Tokyo, Japan

Toshikazu Shibuya

Department of Production Systems Engineering, Oita University, Oita, Japan

J. Electron. Packag 124(4), 323-327 (Dec 12, 2002) (5 pages) doi:10.1115/1.1501304 History: Received May 01, 2002; Online December 12, 2002
Copyright © 2002 by ASME
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References

Figures

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Plastic encapsulated package
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Cross section of cracked package
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Notch bending specimen geometry and loading configuration
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Load-displacement curve
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Relationship between nominal stress and radius of notch tip
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Analyzed model geometry and loading configuration
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Finite-element models of specimen
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Stress distribution in specimen. (a) σx and (b) σy
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Stress distribution around notch tip and fracture criterion (Resin A). (a) Room temperature and (b) 250°C.
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Stress distribution around notch tip and fracture criterion (Resin B). (a) Room temperature and (b) 250°C.

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