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TECHNICAL BRIEFS

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

[+] Author and Article Information
G. Y. Li, Y. C. Chan

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 124(3), 305-310 (Jul 26, 2002) (6 pages) doi:10.1115/1.1486012 History: Received August 03, 1998; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Cross section of a soldered component on a ceramic substrate after aging at 150°C for 32 days. Lower dark region: alumina ceramic substrate. Upper dark region: component. Between substrate and component is the solder joint after thinning.
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TEM micrograph of point (A) marked in Fig. 1
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EDX spectra of selected areas (a), (b), (c), and (d) marked in Fig. 2. (a) Ag-Sn and Pd-Sn intermetallics; (b) γ-Ag3Sn; (c) Sn-rich phase; (d) Ag-Sn and Pd-Sn intermetallics
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TEM micrograph of point (B) marked in Fig. 1
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EDX spectra of selected areas (a), (b), (c), and (d) marked in Fig. 4. (a) PdSn2; (b) PdSn4; (c) Ag-Sn and Pd-Sn intermetallics; (d) Sn-rich phase
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TEM micrograph of point (C) marked in Fig. 1
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EDX spectra of selected areas (a), (b), (c), and (d) marked in Fig. 6. (a) Sn-rich phase; (b) γ -Ag3Sn; (c) Ag-Sn and Pd-Sn intermetallics; (d) Tin-rich phase.
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Identification of metallurgical phases in the thick film solder joint using SAED. (A) TEM micrograph of conductor and solder interface after aging at 150°C for 32 days. (B) Electron diffraction pattern (EDP) of selected area (a), ζ-Ag5Sn; (C) EDP of selected area (b), PbPd3; (D) EDP of selected area (c), Pd2Sn.
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Identification of metallurgical phases in the thick film solder joint using SAED. (A) TEM micrograph of conductor and solder interface after aging at 150°C for 32 days. (B) EDP of selected area (a), Pd2Sn; (C) EDP of selected area (b): γ-Ag3Sn; (D) EDP of selected area (c): Sn-rich phase.
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X-Ray diffraction angular spectra of a cross section of a solder joint after 32 days aging at 150°C
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X-Ray diffraction angular spectra of a crack surface of a solder joint after 32 days aging at 150°C

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