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PAPERS ON RELIABILITY

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

[+] Author and Article Information
Pradeep Sharma, Abhijit Dasgupta

CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742

J. Electron. Packag 124(3), 298-304 (Jul 26, 2002) (7 pages) doi:10.1115/1.1493203 History: Received December 21, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Sharma, P., and Dasgupta, A., 2002, “Micro-Mechanics Of Creep-Fatigue Damage In Pb-Sn Solder Due To Thermal Cycling: Part I (Formulation),” ASME J. Electron. Packag., published in this issue, pp.
Sharma, P., 2000, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
Sharma, P., and Dasgupta, A., submitted to the Journal of Applied Physics.
Sharma, P., and Dasgupta, A., 2001, ASME J. Eng. Mater. Technol.
Cocks,  A. C. F., and Ashby,  M. F., 1982, “On creep fracture by void growth,” Prog. Mater. Sci., 27, pp. 189–244.
Dasgupta,  A., Oyan,  C., Barker,  D., and Pecht,  M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME J. Electron. Packag., 144, pp. 152–160.
Darbha,  K., Okura,  J., Shetty,  S., Dasgupta,  A., Reinikainen,  T., Zhu,  J., and Caers,  J., 1999, ASME J. Electron. Packag., 121, pp. 237–242.
Frear, D. R., Burchett, S. N., and Rashid, M. M., 1995, “A microstructurally based model of solder joints under conditions of thermomechanical fatigue,” Advances in Electronic Packaging 1995, Proceedings of the International Electronic Packaging Conference-INTERpack ’95 p. 2 vol. xvi+1320, 347–60, vol. 1.
Upadhyayula, K. S., 1998, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
Okura, J. H., and Dasgupta, A., 1999, “Effect of High Temperature Aging on Solder Joint Degradation in FCOB Assemblies,” Interpack99, ASME, June.
Onck,  P., and van der Giessen,  E., 1998, “Micromechanics of creep fracture: simulation of intergranular crack growth,” Comput. Mater. Sci., 13(1–3), pp. 90–102.

Figures

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Void radius fraction evolution in the first cycle for the nominal case
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Void radius fraction and failure Locus evolution until complete failure
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Progression of cyclic hysteresis loop with damage
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Cycles-to-failure versus ramp rate
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Effect of dwell-time on cycles-to-failure
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Cycles-to-failure versus triaxiality ratio
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Effect of grain size on cycles-to-failure
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Contour plot of optimum time as predicted by microscale model
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Contour plot of optimum time as predicted by energy partitioning model
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Comparison of hysteresis loops for dwell times of 600 and 1000 s
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Macro-scale stress histories for Dwell times of 600 and 1000 s

Tables

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