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PAPERS ON RELIABILITY

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

[+] Author and Article Information
Pradeep Sharma, Abhijit Dasgupta

CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742

J. Electron. Packag 124(3), 298-304 (Jul 26, 2002) (7 pages) doi:10.1115/1.1493203 History: Received December 21, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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References

Figures

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Void radius fraction evolution in the first cycle for the nominal case
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Void radius fraction and failure Locus evolution until complete failure
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Progression of cyclic hysteresis loop with damage
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Cycles-to-failure versus ramp rate
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Effect of dwell-time on cycles-to-failure
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Cycles-to-failure versus triaxiality ratio
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Effect of grain size on cycles-to-failure
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Contour plot of optimum time as predicted by microscale model
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Contour plot of optimum time as predicted by energy partitioning model
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Comparison of hysteresis loops for dwell times of 600 and 1000 s
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Macro-scale stress histories for Dwell times of 600 and 1000 s

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