Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

[+] Author and Article Information
Pradeep Sharma, Abhijit Dasgupta

CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742

J. Electron. Packag 124(3), 292-297 (Jul 26, 2002) (6 pages) doi:10.1115/1.1493202 History: Received December 21, 2001; Online July 26, 2002
Copyright © 2002 by ASME
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Grahic Jump Location
Idealized geometric configuration of the physical problem
Grahic Jump Location
Variation of normalized micro-stress with time




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