0
PAPERS ON RELIABILITY

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

[+] Author and Article Information
E. Suhir

Fellow ASME, University of Illinois at Chicago and ERS Co., 727 Alvine Ct., dos Altos, CA 94024

J. Electron. Packag 124(3), 281-291 (Jul 26, 2002) (11 pages) doi:10.1115/1.1486470 History: Received April 10, 2002; Online July 26, 2002
Copyright © 2002 by ASME
Your Session has timed out. Please sign back in to continue.

References

Suhir, E., 1997, Applied Probability for Engineers and Scientists, McGraw-Hill, NY.
Di Giacomo, G., 1997, Reliability of Electronic Packages and Semiconductor Devices, McGraw-Hill, New York.
Fukuda, M., 1991, Reliability and Degradation of Semiconductor Lasers and LEDs, Artech House.
Svelto, O., and Hanna, D. C., 1998, Principles of Lasers, Plenum, NY.
“High-Speed Semiconductor Lasers for Communication,” 1997, Proc. of the SPIE, Vol. 3038.
Suhir, E., Fukuda, M., Kurkjian, C. R., eds., 1998, “Reliability of Photonic Materials and Structures,” Materials Research Society Symposia Proceedings, Vol. 531.
Suhir, E., Cammarata, R. C., Chung, D. D. L., and Jono, M., 1991, “Mechanical Behavior of Materials and Structures in Microelectronics,” Materials Research Society Symposia Proceedings, Vol. 226.
Katz, A., Pecht, M., and Suhir, E., 2000, “Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments,” Proceedings of the International Symposium on Microelectronics and Packaging, IMAPS, Israel.
Suhir,  E., 2000, “Microelectronics and Photonics—the Future,” Microelectronics, 31, (11)-12.
Suhir, E., and Poborets, B., 1990, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability,” Proc. of the 40th Elect. Comp. and Techn. Conf., Las Vegas, Nevada, May 1990; see also: ASME J. Electron. Packag., 112 (2).
Suhir,  E., 1989, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques,” ASME J. Electron. Packag., 111(2), June.
Suhir, E., 2001, “Thermomechanical Stress Modeling in Microelectronics and Photonics,” Electronic Cooling, 7 (4).
Hawkins, B. M., Hawthorne, R. A. III, Guenter, J. K., Tatum, J. A., and Biard, J. R., 2002, “Reliability of Various Size Oxide Aperture VCSELS,” 52-nd ECTC, San Diego, CA.
ASM Committee on Laser Welding, Metals Handbook, Ed. 9, Vol. 6, pp. 647–671.
Jellison, J. L., 1991, “Fundamentals of Metals Joining with Lasers,” Sandia National Laboratories, Albuquerque, NM, NTIS, DE92000789.
Rangwala, S., 1990, “A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages,” ASME Winter Annual Meeting, 90-WA/EEP-24.
Suhir, E., 2001, “Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly,” US Patent #6,239,382.

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In